Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices
by
Yeh, L.-T. (Lian-Tuu), 1944-
Title
:
Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices
Author
:
Yeh, L.-T. (Lian-Tuu), 1944-
Personal Author
:
Yeh, L.-T. (Lian-Tuu), 1944-
Publication Information
:
New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016) : American Society of Mechanical Engineers, 2002.
Physical Description
:
1 electronic text (xxi, 414 p.) : ill., digital file.
Series
:
ASME Press book series on electronic packaging
ASME Press book series on electronic packaging.
Contents
:
1. Introduction -- 2. Conduction -- 3. Convection -- 4. Radiation -- 5. Pool boiling -- 6. Flow boiling -- 7. Condensation -- 8. Extended surfaces -- 9. Thermal interface resistance -- 10. Components and printed circuit boards -- 11. Direct air cooling and fans -- 12. Natural and mixed convection -- 13. Heat exchangers and cold plates -- 14. Advanced cooling technologies I: single-phase liquid cooling -- 15. Advanced cooling technologies II: two-phase flow cooling -- 16. Heat pipes -- 17. Thermoelectric coolers.
Abstract
:
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.
Subject Term
:
Electronic apparatus and appliances -- Cooling.
Electronic apparatus and appliances -- Thermal properties.
Heat -- Transmission.
Genre
:
Electronic books.
Added Author
:
Chu, R. C. (Richard C.), 1933-
Added Corporate Author
:
American Society of Mechanical Engineers.
Electronic Access
:
| Library | Material Type | Item Barcode | Shelf Number | Status |
|---|
| IYTE Library | E-Book | 595783-1001 | TK7870.25 .Y44 2002 EB | ASME E-Books |