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Essentials of electronic packaging a multidisciplinary approach / Viswanadham, Puligandla.
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Packaging, Committee on Materials for High-Density Electronic.
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Materials for High-Density Electronic Packaging and Interconnection. Packaging, Committee on
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability
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Electronic packaging and interconnection series
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Table of contents http://www.loc.gov/catdir/toc/mh022/95038782.html
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Electronic packaging and interconnection series
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