Cover -- The Circuit Designer's Companion -- Contents -- Introduction -- Introduction to the second edition -- Chapter 1 Grounding and wiring -- 1.1 Grounding -- When to consider grounding -- 1.1.1 Grounding within one unit -- 1.1.2 Chassis ground -- 1.1.3 The conductivity of aluminium -- Other materials -- 1.1.4 Ground loops -- 1.1.5 Power supply returns -- Varying loads -- Power rail feed -- Conductor impedance -- 1.1.6 Input signal ground -- Connection to 0V elsewhere on the pcb -- Connection to 0V within the unit -- External ground connection -- 1.1.7 Output signal ground -- Avoiding the common impedance -- 1.1.8 Inter-board interface signals -- Partitioning the signal return -- 1.1.9 Star-point grounding -- 1.1.10 Ground connections between units -- Breaking the ground link -- 1.1.11 Shielding -- Which end to ground for LF shielding -- Electrostatic screening -- Surface transfer impedance -- 1.1.12 The safety earth -- 1.2 Wiring and cables -- 1.2.1 Wire types -- Wire inductance -- Equipment wire -- 1.2.2 Cable types -- 1.2.3 Power cables -- 1.2.4 Data and multicore cables -- Data communication cables -- Structured data cable -- Shielding and microphony -- 1.2.5 RF cables -- 1.2.6 Twisted pair -- 1.2.7 Crosstalk -- Digital crosstalk -- 1.3 Transmission lines -- Transmission line effects -- Critical lengths for pulses -- 1.3.1 Characteristic impedance -- 1.3.2 Time domain -- Forward and reflected waves -- Ringing -- The Bergeron diagram -- The uses of mismatching -- 1.3.3 Frequency domain -- Standing wave distribution vs. frequency -- Impedance transformation -- Lossy lines -- Chapter 2 Printed circuits -- 2.1 Board types -- 2.1.1 Materials -- Epoxy-glass -- 2.1.2 Type of construction -- 2.1.3 Choice of type -- 2.1.4 Choice of size -- Sub-division boundaries -- Panelisation -- 2.1.5 How a multilayer board is made -- 2.2 Design rules.

2.2.1 Track width and spacing -- Conductor resistance -- Voltage breakdown and crosstalk -- Constant impedance -- 2.2.2 Hole and pad size -- Vias -- Through hole pads -- Surface mount pads -- 2.2.3 Track routing -- 2.2.4 Ground and power distribution -- Ground rail inductance -- Gridded ground layout -- The ground plane -- Inside or outside layers -- Multiple ground planes -- 2.2.5 Copper plating and finishing -- 2.2.6 Solder resist -- Screen printed resists -- Photo-imaged film -- 2.2.7 Terminations and connections -- Two-part connectors -- Edge connectors -- 2.3 Board assembly: surface mount and through hole -- 2.3.1 Surface mount design rules -- Solder process -- Printed circuit board quality -- Thermal stresses -- Cleaning and testing -- 2.3.2 Package placement -- 2.3.3 Component identification -- Polarity indication -- 2.4 Surface protection -- Variations in surface resistance -- Circuit design vs. surface resistance -- 2.4.1 Guarding -- 2.4.2 Conformal coating -- Coating vs. encapsulation -- Steps to take before coating -- Application -- Test and rework -- 2.5 Sourcing boards and artwork -- 2.5.1 Artwork -- Using a bureau -- Disadvantages of a bureau -- 2.5.2 Boards -- Chapter 3 Passive components -- 3.1 Resistors -- 3.1.1 Resistor types -- Surface mount chip -- Metal film -- Carbon -- Wirewound -- Precision resistors -- Resistor networks -- 3.1.2 Tolerancing -- Tolerance variations -- 3.1.3 Temperature coefficient -- 3.1.4 Power -- 3.1.5 Inductance -- 3.1.6 Pulse handling -- Limiting element voltage (LEV) -- 3.1.7 Extreme values -- Very low values -- Very high values -- 3.1.8 Fusible and safety resistors -- 3.1.9 Resistor networks -- Production efficiency -- Value tracking: thick film versus thin film -- 3.2 Potentiometers -- 3.2.1 Trimmer types -- Carbon -- Cermet -- Wirewound -- Multi-turn -- 3.2.2 Panel types -- Carbon, cermet and wirewound.

Conductive plastic -- 3.2.3 Pot applications -- Use as a rheostat -- Adjustability -- Law accuracy -- Manufacturing processes -- 3.3 Capacitors -- 3.3.1 Metallised film & paper -- Polyester -- Polycarbonate -- Polypropylene and polystyrene -- Metallised paper -- 3.3.2 Multilayer ceramics -- COG -- X5R and X7R -- Y5V and Z5U -- 3.3.3 Single-layer ceramics -- Barrier layer -- Low-K and High-K dielectrics -- 3.3.4 Electrolytics -- Construction -- Leakage -- Ripple current and ESR -- Temperature and lifetime -- 3.3.5 Solid tantalum -- Tantalum chip capacitors -- 3.3.6 Capacitor applications -- Value shifts -- 3.3.7 Series capacitors and dc leakage -- Adding bleed resistors -- 3.3.8 Dielectric absorption -- 3.3.9 Self resonance -- Consequences of self-resonance -- 3.4 Inductors -- 3.4.1 Permeability -- Ferrites -- Iron powder -- 3.4.2 Self-capacitance -- 3.4.3 Inductor applications -- Tuned circuits -- Power circuits -- Suppression -- 3.4.4 The danger of inductive transients -- Relay coils -- Transient protection -- Protection against negative transients -- AC circuits -- 3.5 Crystals and resonators -- Angle of cut -- 3.5.1 Resonance -- 3.5.2 Oscillator circuits -- Drive level resistance -- Series circuit -- Layout -- 3.5.3 Temperature -- 3.5.4 Ceramic resonators -- Chapter 4 Active components -- 4.1 Diodes -- 4.1.1 Forward bias -- Forward current -- Temperature dependence of forward voltage -- 4.1.2 Reverse bias -- Breakdown -- 4.1.3 Leakage -- Leakage variability -- 4.1.4 High-frequency performance -- 4.1.5 Switching times -- Reverse recovery -- Interference due to fast recovery -- 4.1.6 Schottky diodes -- General purpose -- RF mixers -- Rectifiers -- 4.1.7 Zener diodes -- Slope resistance -- Leakage -- Temperature coefficient -- Precision zeners -- Zener noise -- 4.1.8 The Zener as a clamp -- An application example -- 4.2 Thyristors and triacs.

4.2.1 Thyristor versus triac -- 4.2.2 Triggering characteristics -- 4.2.3 False triggering -- 4.2.4 Conduction -- 4.2.5 Switching -- Turn-off -- 4.2.6 Snubbing -- Values for R and C -- 4.3 Bipolar transistors -- 4.3.1 Leakage -- A simple leakage example -- Adding a base-emitter resistor -- 4.3.2 Saturation -- 4.3.3 The Darlington -- 4.3.4 Safe operating area -- Second breakdown -- SOA curve -- 4.3.5 Gain -- 4.3.6 Switching and high frequency performance -- Speeding up the turn-off -- 4.3.7 Grading -- 4.4 Junction Field Effect transistors -- 4.4.1 Pinch-off -- 4.4.2 Applications -- Analogue switches -- Current regulators -- 4.4.3 High impedance circuits -- The gate current breakpoint -- Depressed Z[sub(in)] -- 4.5 MOSFETs -- 4.5.1 Low-power MOSFETs -- Gate breakdown -- Protection for the gate -- MOSFET tradeoffs -- 4.5.2 VMOS Power FETs -- 4.5.3 Gate drive impedance -- Gate-source overvoltage -- Source lead inductance -- 4.5.4 Switching speed -- 4.5.5 On-state resistance -- P-channel VMOS -- 4.6 IGBTs -- 4.6.1 IGBT structure -- 4.6.2 Advantages over MOSFETs and bipolars -- 4.6.3 Disadvantages -- Chapter 5 Analogue integrated circuits -- 5.1 The ideal op-amp -- 5.1.1 Applications categories -- 5.2 The practical op-amp -- 5.2.1 Offset voltage -- Output saturation due to amplified offset -- Reducing the effect of offset -- Offset drift -- Circuit techniques to remove the effect of drift -- 5.2.2 Bias and offset currents -- Bias current levels -- Output offsets due to bias and offset currents -- 5.2.3 Common mode effects -- CMRR -- PSRR -- 5.2.4 Input voltage range -- Absolute maximum input -- 5.2.5 Output parameters -- Power rail voltage -- Load impedance -- 5.2.6 AC parameters -- 5.2.7 Slew rate and large signal bandwidth -- Slew rate -- Large-signal bandwidth -- Slewing distortion -- 5.2.8 Small-signal bandwidth -- 5.2.9 Settling time.

5.2.10 The oscillating amplifier -- Ground coupling -- Power supply coupling -- Output stage instability -- Stray capacitance at the input -- Parasitic feedback -- 5.2.11 Open-loop gain -- Sagging A[sub(OL)] -- 5.2.12 Noise -- Thermal noise -- Amplifier noise -- Noise bandwidth -- 5.2.13 Supply current and voltage -- Supply voltage -- Supply current -- I[sub(S)] vs. speed and dissipation -- 5.2.14 Temperature ratings -- Specification validity -- Package reliability -- 5.2.15 Cost and availability -- When to use industry standards -- When not to use industry standards -- Quad or dual packages -- 5.2.16 Current feedback op-amps -- 5.3 Comparators -- 5.3.1 Output parameters -- 5.3.2 AC parameters -- Overdrive -- Load impedance -- The advantages of the active low -- Pulse timing error -- 5.3.3 Op-amps as comparators (and vice versa) -- 5.3.4 Hysteresis and oscillations -- The subtle effects of edge oscillation -- Minimise stray feedback -- Hysteresis -- 5.3.5 Input voltage limits -- Comparator parameters vs. input voltage -- 5.3.6 Comparator sourcing -- 5.4 Voltage references -- 5.4.1 Zener references -- 5.4.2 Band-gap references -- Costs and interchangeability -- 5.4.3 Reference specifications -- Line and load regulation -- Output voltage tolerance -- Ouput voltage temperature coefficient -- Long-term stability -- Settling time -- Minimum supply current -- 5.5 Circuit modelling -- Chapter 6 Digital circuits -- 6.1 Logic ICs -- 6.1.1 Noise immunity and thresholds -- Susceptibility to noise -- Current immunity -- Use of a pull-up -- Dynamic noise immunity -- 6.1.2 Fan-out and loading -- Dynamic loading -- 6.1.3 Induced switching noise -- Synchronous switching -- 6.1.4 Decoupling -- Distance -- 6.1.5 Unused gate inputs -- 6.2 Interfacing -- 6.2.1 Mixing analogue and digital -- Ground noise -- Filtering -- Segregation -- Single-board systems.

Multi-board systems.