Contents -- Dedication -- Foreword -- Preface -- 1. Getting History Right -- 2. Importance of the IC Invention -- 3. What is an IC? -- 4. Sole Credit to Kilby and Noyce -- 5. Key Points to Get History Right -- 6. Key Points of Jack S. Kilby's Invention -- 7. Key Points of Robert (Bob) N. Noyce's Invention -- 8. Other Contributors -- 9. Lack of contributions of Kilby and the others to pursue monolithic-ICs -- 10. Historical Perspective and Accuracy -- 11. My Experience -- 12. Useful Product -- 13. Funding for putting all the facts of the invention of ICs on historical record -- 14. Acknowledgements -- Chapter 1: Introduction -- 1. What is an IC? -- 2. Key Requirements for making the IC and did Kilby and Noyce meet them? -- 3. Sole credit to Kilby and Noyce -- 4. A few facts in the mystery of the invention of ICs -- 5. My qualifications -- 6. Getting history right -- 7. The case of Einstein -- 8. Why getting history right is important? -- 9. Documented facts -- 10. What are documented facts? -- 11. All ICs sold from day one have been Si monolithic-ICs -- 12. Three questions need to be answered up front -- 13. Victory/success and defeat/failure -- 14. Disclosure of the basic concept for ICs by others earlier than Kilby -- 15. Brief comments on the basic concepts of IC invention documented by Kilby, Dummer, Johnson and Stewart given above -- 16. Concepts given by Saxena in 1954 -- 17. Inputs for Noyce's patent and investigation of Kilby's patents -- 18. Other aspects which contributed to the invention and fantastic success of ICs -- 19. Answers to the three questions raised in Section 11 -- 20. For whom is the book primarily intended and at what level? -- Chapter 2: Discovery, Invention, Improvement, Patents and Publications -- 1. Discovery -- 2. Invention -- 3. Improvement -- 4. Patents -- 5. Publications -- 6. Trade secrets.

Chapter 3: Evolution of Miniaturization in Electronics: ICs to VLSICs to ULSICs and Beyond in the Future -- 1. Present status of miniaturization -- 2. Need for miniaturization and its evolution -- 2.1. Hybrid-Integrated Circuits (Hybrid-ICs), and -- 2.2. Monolithic-Integrated Circuits (Monolithic-ICs). -- 3. When an electronic circuit is an IC? -- 3.1. Hybrid-ICs fabricated with Packaged Chips = Hybrid-PC-ICs. -- 3.2. Hybrid-ICs fabricated with Unpackaged Chips = Hybrid-UC-ICs. -- 4. When does a hybrid-IC become a monolithic-IC? -- 5. Fast evolution from early ICs to VLSICs to ULSICs -- 6. Beyond ULSICs into the future -- 7. Some of the advantages of 3D-Si-ICs over conventional 2D-Si-ICs -- 8. Some of the advantages of UPICs over conventional 2D-Si-ICs -- 9. Future -- Chapter 4: Monolithic vs. Hybrid Concepts in ICs -- 1. Hybrid-integrated circuits (hybrid-ICs) -- 1.1. Hybrid-ICs fabricated with Packaged Chips = Hybrid-PC-ICs. -- 1.2. Hybrid-ICs fabricated with Unpackaged Chips = Hybrid-UC-ICs. -- 2. Where do we draw the line in hybrid-ICs to define the onset of miniaturized Integrated Circuits? -- 3. Monolithic-integrated circuit (monolithic-IC) -- Chapter 5: Summary of the IC Fabrication, Inventions, Relevant Patent Filings and Issue Dates, and Methodology of Analyses and Numbering -- 1. Summary of IC fabrication -- 2. Summary of the inventions of integrated circuit by Kilby and Noyce as documented in the literature -- 2.1. Kilby's strong and weak points -- important original figures -- 2.2. Noyce's strong and weak points -- important original figures -- 3. Sequence of relevant patent filing and issue dates -- 4. Comparison of the sequence of relevant patent filing and issue dates given above with that given in the earlier NSTI paper12 -- 5. Key features of Saxena's patent # 3,687,722 on interconnects36.

6. Controversy over public disclosures and patent filing dates -- 7. Additional important facts from the published records -- 8. Figures from Kilby's and Noyce's patents and correspondence from USPTO -- 9. Methodology of Analyses of Patents and Papers, and Numbering of the Tables and Figures -- 9.1. Methodology -- 9.2. Numbering -- Chapter 6: Hoerni and Lehovec Inventions -- 1. Importance of Hoerni and Lehovec inventions to the fundamental invention of ICs -- 2. Importance of choosing Si over Ge and other semiconductors -- 3. Sequence of important technical work and serendipity which led to the discovery of planar technology -- 4. Methodology to analyze Hoerni's and Lehovec's patents -- 5. Quotation of key points from Jean Hoerni's patent no. 3,025,589, "Method of Manufacturing Semiconductor Devices", filed May 1, 1959 -- ser. no. 810,388 -- issued March 20, 1962. -- 6. Quotation of key points from Jean Hoerni's patent no. 3,064,167, "Semiconductor Device" -- filed May 1, 1959 -- ser. no. 810,388. Divided and this application May 19, 1960, ser. no. 30,256 -- issued Nov. 13, 1962. -- 7. Quotation of key points from Kurt Lehovec's patent no. 3,029,366, "Multiple Semiconductor Assembly" -- filed April 22, 1959 -- ser. no. 805,249 -- issued April 10, 1962. -- 8. Copy of the original patent no. 3,025,589 of Jean Hoerni: "Method of Manufacturing Semiconductor Devices", filed May 1, 1959 -- ser. no. 810,388 -- issued March 20, 1962. -- 9. Copy of the original patent no. 3,064,167 of Jean Hoerni: "Semiconductor Device" -- filed May 1, 1959 -- ser. no. 810,388. Divided and this application May 19, 1960, ser. no. 30,256 -- issued Nov. 13, 1962. -- 10. Copy of the original patent no. 3,029,366 of Kurt Lehovec: "Multiple Semiconductor Assembly", filed April 22, 1959 -- ser. no. 805,249 -- issued April 10, 1962.

11. Copy of Kurt Lehovec's paper,26 "Invention of p-n Junction Isolation in Integrated Circuits", p. 495-496, IEEE transactions on electron devices, Vol. ED-25, no. 4, April, 1978. -- 12. Copy of the first page of the final hearing on March 16, 1966, of Kilby vs. Lehovec. See reference 8 of Lehovec's paper,26 given as "Decision of the Board of Interferences in the Patent Interference Kilby vs. Lehovec," no. 93612, April 5, 1966. Quot from last but one paragraph of Lehovec's paper is as follows: -- Chapter 7: Kilby's Invention of IC: Key Patents, Claims and Analyses -- 1. Introductory comments on Kilby's invention -- 2. A few important facts and comments on the invention of ICs by Kilby -- 3. Original patents -- 4. Summary of the invention -- 5. Key figures -- 6. Key claims -- 7. Reduction to practice -- 8. Choice of semiconductor -- 9. Fabrication method of devices -- 10. Insulating layers -- 11. Interconnects -- 12. Impact of 35 USC 112 -- 13. Overall comments -- 14. Kilby's OA (Original Application) No. 791,602, "Miniaturized Electronic Circuits and Method of Making", (Claimed to have been filed on Feb. 6, 1959, but recorded filing date was May 6, 1959 -- no patent action taken and no Patent was issued on this -- 14.1. Key items of OA No. 791,602 -- 14.2 Detailed analyses of all the claims of Kilby's OA no. 791,602 -- 15. Kilby's Patent No. 3,138,743, "Miniaturized Electronic Circuits" -- filed Feb. 6, 1959 -- Serial No. 791,602 -- issued June 23, 1964 -- 16. Kilby's Patent No. 3,138,744 "Miniaturize Self-Contained Circuit Modules and Method of Fabrication", filed May 6, 1959 -- Serial No. 811,486 -- issued June 23, 1964 -- 16.1. Summary of the Invention -- 16.2. Key Figures -- 16.3. Key Claims -- 16.4. Reduction to Practice -- 16.5. Choice of Semiconductor -- 16.6. Fabrication Method of Devices -- 16.7. Insulating Layers.

16.8. Isolation of Devices -- 16.9. Interconnects -- 16.10. Impact of 35 USC 112 -- 16.11. Overall Comments -- 17. Summary of Comparisons between Kilby's two IC Patent Nos. 3,138,743 and 3,138,744, and a few additional comments -- 18. Detailed analyses of all the Claims of 3,138,744 -- 19. Kilby's Patent No. 3,261,081, "Method of Making Miniaturized Electronic Circuits", ("Original Application Feb. 6, 1959, Ser. No. 791,602, now Patent No. 3,138,743, dated June 23, 1964. Divided and this Application Mar. 16, 1964, Ser. No. 352,380 -- 2 -- 19.1 Detailed Analyses of all the Claims -- 20. Jack Kilby: Original Application no. 791,602, "Miniaturized Electronic Circuits and Method of Making" -- claimed to have been filed on February 6, 1959, but the recorded filing date by USPTO was May 6, 1959. No patent action was taken and no patent was issued on this application per se. (See Saxena.29,30) -- 21. Jack Kilby: US patent no. 3,138,743, "Miniaturized Electronic Circuits" -- filed February 6, 1959 -- serial no. 791,602 -- issued June 23, 1964. This filing date is controversial because this patent was based on the OA whose filing date was not recorded to be on February 6, 1959. -- 22. Jack Kilby: US patent no. 3,138,744, "Miniaturized Self-contained Circuit Modules and Method of Fabrication" -- filed May 6, 1959 -- serial no. 811,486 -- issued June 23, 1964. -- 23. Jack Kilby: US patent no. 3,261,081, "Method of Making Miniaturized Electronic Circuits" -- USPTO wrote on the front page of the patent, "Original Filed Feb. 6, 1959", and "July 19, 1966" as the patented date. On inside above column 1, the USPTO wrote "Original application February 6, 1959, Ser. No. 791,602, now Patent No. 3,138,743, dated June 23, 1964. Divided and this application Mar. 16, 1964, Ser. No. 352,380", for which this patent no. 3,261,081 was issued on July 19, 1966. As stated in.

Chapter 8: Noyce's Invention of IC: Key Patent, Claims, and Analyses.