Front cover -- Handbook of Deposition Technologies for Films and Coatings : Science, Applications and Technology -- Copyright -- Contents -- Preface to the Third Edition -- List of Abbreviations -- Chapter 1 - Deposition Technologies: An Overview -- The Market -- Introduction -- Aim and Scope -- Definitions and Concepts -- Surface Engineering -- Physical Vapor Deposition Process Terminology -- Classification of Coating Processes -- New Deposition Technologies -- Microstructure and Properties -- Unique Features of Deposited Materials and Gaps in Understanding -- Current Applications -- Decorative/Functional Coating -- Transparent Conductive Thin Films -- Thin Film Solar Cells and Batteries -- Friction and Wear: Nanolaminates and Superlattices -- Cutting Tools -- Gas and Water Permeation Barriers on Plastic -- Biomedical -- Thin Film Solid Oxide Fuel Cells -- Flat Panel Displays and Molecular Electronics -- 'Frontier Areas' for Applications of the Products of Deposition Technology -- Selection Criteria -- Summary -- Deposition Process Definitions -- Conduction and Diffusion Processes -- Chemical Processes -- Wetting Processes -- Spraying Processes -- Physical Vapor Deposition Processes -- References -- Chapter 2 - Plasmas in Deposition Processes -- Introduction -- Particle Collisions, Energy, and Motion -- Collisions: Mean Free Path and Cross-Section -- Electron Kinetic Energy -- Electron Energy Distribution -- Collision Frequencies -- Reaction Rates -- Mobilities -- Conductivity and Diffusion -- Particle Motion in Magnetic Fields -- Plasma Parameters and Collective Behavior -- Plasma Sheaths -- Ambipolar Diffusion -- Plasma Oscillations -- Discharge Plasmas -- Introduction -- Plasma Production and Breakdown -- Cold Cathode Discharges -- Magnetron Discharges -- RF Discharges -- Gas-Phase Plasma Reactions -- Introduction.

Electron-Atom Interactions -- Electron-Molecule Interactions -- Metastable Species and Processes -- Applications of Volume Reactions -- Plasma-Surface Interactions -- Introduction -- Ion Bombardment -- Electron Bombardment -- Photon Interactions -- Summary of Surface Reactions -- An Example: Magnetron Discharge for Deposition -- Summary -- Appendix 2.1 -- References -- Chapter 3 - Surface Preparation for Film and Coating Deposition Processes -- Introduction -- External Cleaning -- Gross Cleaning -- Stripping -- Abrasive Cleaning -- Wet Chemical Etching -- Specific Cleaning -- Solvent Cleaning -- Alkaline Cleaners -- Detergent (Soap) Cleaners -- Solution Additives -- Wet Reaction Cleaning -- Reactive Gas Cleaning -- Reactive Plasma Cleaning -- Application of Fluids -- Immersion -- Spraying -- Vapor Condensation -- Ultrasonic Cleaners -- Removal of Particulate Contamination -- Rinsing -- Ultrapure Water -- Drying, Outgassing, and Outdiffusion -- Drying -- Outgassing -- Outdiffusion -- Evaluating and Monitoring of Cleaning -- Cleaning Tests -- Test: Sheeting -- Test: Contact Angle -- Test: Nucleation -- Test: Adsorption and Desorption Behavior -- Test: Friction and Marking -- Test: Extraction and Analysis -- Test: Surface Analytical Spectroscopies -- Particle Detection on Smooth Surfaces -- Particle Detection on Rough Surfaces -- Recontamination in the Ambient Environment -- Ambient Environment -- Handling -- Storage -- Storage: Passive -- Storage: Active -- In Situ Cleaning -- Sputter Cleaning -- Ion Scrubbing -- Reactive Plasma Cleaning -- Recontamination in the Deposition System -- Some Surface Modification Processes -- Ex Situ Surface Modification -- Surface Morphology -- In Situ Surface Modification -- References -- Chapter 4 - Evaporation : Processes, Bulk Microstructures, and Mechanical Properties -- Introduction -- Scope -- PVD Processes.

Preamble -- PVD Processes -- Electron Beam Evaporation -- Ion-Plating Process -- Sputtering -- Inert Gas Condensation -- Pulsed Laser Deposition -- Co-evaporation Processes -- Advantages and Limitations -- Theory and Mechanisms -- Vacuum Evaporation -- Evaporation Process and Apparatus -- The System -- Vacuum Chamber -- Vacuum Pumping System -- Pressure Measurement -- Evaporation Sources -- Substrate Holders and Heaters -- Deposition Rate Monitors -- Evaporation Sources -- General Considerations -- Resistance-Heated Sources -- Sublimation Sources -- Evaporation Source Materials -- Induction-Heated Sources -- Electron Beam-Heated Sources -- Thermionic Guns -- Plasma Electron Beam Guns -- Comparisons -- Arc Evaporation -- Deposition Rate Monitors and Process Control -- Monitoring of the Vapor Stream -- Ionization Gauge Rate Monitor -- Particle Impingement Rate Monitors -- Ion Current Monitor for Electron Beam-Heated Source -- Spectroscopic Methods -- Monitoring of Deposited Mass -- Microbalances -- Crystal Oscillators -- Monitoring of Specific Film Properties -- Evaporation Process Control -- Thickness Control -- Rate Control -- Deposition of Various Materials -- Deposition of Metals and Elemental Semiconductors -- Deposition of Alloys -- Multiple Sources -- Single Rod-Fed Electron Beam Source -- Deposition of Intermetallic Compounds -- Deposition of Refractory Compounds -- Direct Evaporation -- Reactive Evaporation -- Activated Reactive Evaporation -- Materials Synthesized by Evaporation-Based Processes -- Deposition of Nanocomposite Materials -- Microstructure of PVD Condensates -- Microstructure Evolution -- Texture -- Residual Stresses -- Defects -- Physical Properties of Thin Films -- Mechanical and Related Properties -- Mechanical Properties -- Mechanical Property Determination -- Tensile Properties Of Thin Films.

Mechanical Properties of Thick Condensates and Bulk Deposits -- Tensile Properties and Hardness of Metal and Alloy Deposits -- Magnetic Properties -- References -- Further Reading -- Chapter 5 - Sputter Deposition Processes -- Summary -- Introduction: How Popular is Sputter Deposition? -- What is Sputtering? -- How are the Energetic Particles Generated? -- Efficient Trapping of Electrons Leads to Magnetron Sputter Deposition -- Post Magnetrons -- Planar Magnetrons -- Rotating Cylindrical Magnetrons -- Some General Features of Magnetrons and Magnetron Discharges -- The Discharge Voltage -- I-V Characteristics -- Magnet Balance -- Powering the Magnetron -- Radio-Frequency Magnetron Sputtering -- Direct Current Magnetron Sputtering -- Pulsed DC Magnetron Sputtering -- High-Power Impulse Magnetron Sputtering -- Reactive Magnetron Sputter Deposition -- Hysteresis of Reactive Gas Pressure and Discharge Voltage -- Understanding the Hysteresis Behavior: Modeling the Reactive Sputter Process -- Circumventing the Hysteresis Problem -- Moving Toward the Substrate -- Sputtered Particles -- Other Particles Arriving at the Substrate -- Sputter-Deposited Thin Films: Morphology and Microstructure -- Zone I Films -- Zone T Films -- Zone II Films -- Conclusions -- References -- Chapter 6 - Ion Plating -- Introduction -- Bombardment: Surface and Near-Surface Effects -- Bombardment: Effects on Adhesion, Film Growth, and Properties of the Deposited Material -- Sources of Depositing Material -- Sources of Bombarding Particles -- Substrate Potential -- Some Applications of Ion Plating -- References -- Chapter 7 - Chemical Vapor Deposition -- Introduction -- Important Reaction Zones in CVD -- Design of CVD Experiments -- Classification of CVD Reactions -- Thermodynamics -- Adhesion -- Substrate Cleaning Procedures -- The CVD System -- Gas Dispensing System -- Reactor.

Exhaust System -- Analysis of the Vapor in a CVD Reactor -- Gas Flow Dynamics -- Gas Flow Patterns -- Boundary Layers -- Mass Transport Processes Across a Boundary Layer -- Rate-Limiting Steps During CVD -- Reaction Mechanisms -- Nucleation -- Surface Morphology and Microstructure of CVD Materials -- Selective Deposition -- Area-Selective Growth -- Epitaxial Growth Conditions -- Substrate-Activated Selective Growth -- Adsorption-Induced Selective Growth -- Phase-Selective Deposition -- Phase-Selective Deposition by Differential Nucleation Behavior -- Phase-Selective Deposition Achieved Using Secondary Processes -- Selected Applications of the CVD Technique -- Outlook -- References -- Chapter 8 - Atomic Layer Deposition -- Introduction and Background -- Principle of Atomic Layer Deposition -- Advantages of Atomic Layer Deposition -- Conformality -- Pinhole-free Coatings -- Repeatability of Coatings -- Scalability -- Ultrathin Films -- Artificial Materials -- Atomic Layer Deposition Precursors, Processes, and Materials -- ALD Precursors in General -- Non-Metal Precursors -- Metal Precursors -- Novel ALD Processes -- Applications -- Displays -- Integrated Circuits -- Hard Disk Drives -- Functional and Protective Coatings on Parts -- Photovoltaics -- Optical Components -- Other Applications -- Summary -- References -- Chapter 9 - Plasma-Enhanced Chemical Vapor Deposition of Functional Coatings -- Summary -- Introduction -- Functional Coating Considerations -- Plasma Processing of Materials -- Processes in PECVD -- Process Parameters -- Plasma Gas-Phase Reactions -- Plasma-Surface Interactions -- PECVD Reactors and Deposition Concepts -- General Considerations -- Low-, Medium- and Radio-Frequency Plasma Reactors -- Microwave and Dual-Mode MW/RF Plasma Systems -- Complementary Plasma Systems -- Process Diagnostics and Monitoring.

Diagnostic and Monitoring Techniques.