Failure Analysis : A Practical Guide for Manufacturers of Electronic Components and Systems.
Title:
Failure Analysis : A Practical Guide for Manufacturers of Electronic Components and Systems.
Author:
Bazu, Marius.
ISBN:
9781119990109
Personal Author:
Edition:
1st ed.
Physical Description:
1 online resource (341 pages)
Series:
Quality and Reliability Engineering Series ; v.5
Quality and Reliability Engineering Series
Contents:
FAILURE ANALYSIS -- Contents -- Series Editor's Foreword -- Foreword by Dr Craig Hillman -- Series Editor's Preface -- Preface -- About the Authors -- 1 Introduction -- 1.1 The Three Goals of the Book -- 1.2 Historical Perspective -- 1.2.1 Reliability Prehistory -- 1.2.2 The Birth of Reliability as a Discipline -- 1.2.3 Historical Development of Reliability -- 1.2.4 Tools for Failure Analysis -- 1.3 Terminology -- 1.4 State of the Art and Future Trends -- 1.4.1 Techniques of Failure Analysis -- 1.4.2 Failure Mechanisms -- 1.4.3 Models for the Physics-of-Failure -- 1.4.4 Future Trends -- 1.5 General Plan of the Book -- References -- 2 Failure Analysis - Why? -- 2.1 Eight Possible Applications -- 2.2 Forensic Engineering -- 2.2.1 FA at System Level -- 2.2.2 FA at Component Level -- 2.3 Reliability Modelling -- 2.3.1 Economic Benefits of Using Reliability Models -- 2.3.2 Reliability of Humans -- 2.4 Reverse Engineering -- 2.5 Controlling Critical Input Variables -- 2.6 Design for Reliability -- 2.7 Process Improvement -- 2.7.1 Reliability Assurance -- 2.8 Saving Money through Early Control -- 2.9 A Synergetic Approach -- 2.9.1 Synergies of Technological Factors -- 2.9.2 Test Structures -- 2.9.3 Packaging Reliability -- 2.9.4 Synergies of Operational Stress Factors -- 2.9.5 Synergetic Team -- References -- 3 Failure Analysis - When? -- 3.1 Failure Analysis during the Development Cycle -- 3.1.1 Concurrent Engineering -- 3.1.2 Failure Analysis during the Design Stage -- 3.1.3 Virtual Prototyping -- 3.1.4 Reliability Testing during the Development Cycle -- 3.2 Failure Analysis during Fabrication Preparation -- 3.2.1 Reliability Analysis of Materials -- 3.2.2 Degradation Phenomena in Polymers used in Electron Components -- 3.3 FA during Fabrication -- 3.3.1 Manufacturing History -- 3.3.2 Reliability Monitoring -- 3.3.3 Wafer-Level Reliability.
3.3.4 Yield and Reliability -- 3.3.5 Packaging Reliability -- 3.3.6 Improving Batch Reliability: Screening and Burn-In -- 3.4 FA after Fabrication -- 3.4.1 Standard-Based Testing -- 3.4.2 Knowledge-Based Testing -- 3.5 FA during Operation -- 3.5.1 Failure Types during Operation -- 3.5.2 Preventive Maintenance of Electronic Systems -- References -- 4 Failure Analysis - How? -- 4.1 Procedures for Failure Analysis -- 4.2 Techniques for Decapsulating the Device and for Sample Preparation -- 4.2.1 Decapping Techniques -- 4.2.2 Decapsulation Techniques -- 4.2.3 Cross-Sectioning -- 4.2.4 Focused Ion Beam -- 4.2.5 Other Techniques -- 4.3 Techniques for Failure Analysis -- 4.3.1 Electrical Techniques -- 4.3.2 Optical Microscopy -- 4.3.3 Scanning Probe Microscopy (SPM) -- 4.3.4 Microthermographical Techniques -- 4.3.5 Electron Microscopy -- 4.3.6 X-Ray Techniques -- 4.3.7 Spectroscopic Techniques -- 4.3.8 Acoustic Techniques -- 4.3.9 Laser Techniques -- 4.3.10 Holographic Interferometry -- 4.3.11 Emission Microscopy -- 4.3.12 Atom Probe -- 4.3.13 Neutron Radiography -- 4.3.14 Electromagnetic Field Measurements -- 4.3.15 Other Techniques -- References -- 5 Failure Analysis - What? -- 5.1 Failure Modes and Mechanisms at Various Process Steps -- 5.1.1 Wafer Level -- 5.1.2 Packaging -- 5.1.3 Operation -- 5.2 Failure Modes and Mechanisms of Passive Electronic Parts -- 5.2.1 Resistors -- 5.2.2 Capacitors -- 5.2.3 Varistors -- 5.2.4 Connectors -- 5.2.5 Inductive Elements -- 5.2.6 Embedded Passive Components -- 5.3 Failure Modes and Mechanisms of Silicon Bi Technology -- 5.3.1 Silicon Diodes -- 5.3.2 Bipolar Transistors -- 5.3.3 Thyristors and Insulated-Gate Bipolar Transistors -- 5.3.4 Bipolar Integrated Circuits -- 5.4 Failure Modes and Mechanisms of MOS Technology -- 5.4.1 Junction Field-Effect Transistors -- 5.4.2 MOS Transistors -- 5.4.3 MOS Integrated Circuits.
5.4.4 Memories -- 5.4.5 Microprocessors -- 5.4.6 Silicon-on-Insulator Technology -- 5.5 Failure Modes and Mechanisms of Optoelectronic and Photonic Technologies -- 5.5.1 Light-Emitting Diodes -- 5.5.2 Photodiodes -- 5.5.3 Phototransistors -- 5.5.4 Optocouplers -- 5.5.5 Photonic Displays -- 5.5.6 Solar Cells -- 5.6 Failure Modes and Mechanisms of Non-Silicon Technologies -- 5.6.1 Diodes -- 5.6.2 Transistors -- 5.6.3 Integrated Circuits -- 5.7 Failure Modes and Mechanisms of Hybrid Technology -- 5.7.1 Thin-Film Hybrid Circuits -- 5.7.2 Thick-Film Hybrid Circuits -- 5.8 Failure Modes and Mechanisms of Microsystem Technologies -- 5.8.1 Microsystems -- 5.8.2 Nanosystems -- References -- 6 Case Studies -- 6.1 Case Study No. 1: Capacitors -- 6.1.1 Subject -- 6.1.2 Goal -- 6.1.3 Input Data -- 6.1.4 Sample Preparation -- 6.1.5 Working Procedure and Results -- 6.1.6 Output Data -- 6.2 Case Study No. 2: Bipolar Power Devices -- 6.2.1 Subject -- 6.2.2 Goal -- 6.2.3 Input Data -- 6.2.4 Working Procedure for FA and Results -- 6.2.5 Output Data -- 6.3 Case Study No. 3: CMOS Devices -- 6.3.1 Subject -- 6.3.2 Goal -- 6.3.3 Input Data -- 6.3.4 Working Procedure for FA and Results -- 6.3.5 Output Data -- 6.4 Case Study No. 4: MOS Field-Effect Transistors -- 6.4.1 Subject -- 6.4.2 Goal -- 6.4.3 Input Data -- 6.4.4 Sample Preparation -- 6.4.5 Working Procedure for FA -- 6.4.6 Results -- 6.4.7 Output Data -- 6.5 Case Study No. 5: Thin-Film Transistors -- 6.5.1 Subject -- 6.5.2 Goal -- 6.5.3 Input Data -- 6.5.4 Sample Preparation -- 6.5.5 Working Procedure for FA and Results -- 6.5.6 Output Data -- 6.6 Case Study No. 6: Heterojunction Field-Effect Transistors -- 6.6.1 Subject -- 6.6.2 Goals -- 6.6.3 Input Data -- 6.6.4 Sample Preparation -- 6.6.5 Working Procedure and Results -- 6.6.6 Output Data -- 6.7 Case Study No. 7: MEMS Resonators -- 6.7.1 Subject -- 6.7.2 Goal.
6.7.3 Input Data -- 6.7.4 Sample Preparation -- 6.7.5 Working Procedure for FA and Results -- 6.7.6 Output Data -- 6.8 Case Study No. 8: MEMS Micro-Cantilevers -- 6.8.1 Subject -- 6.8.2 Goal -- 6.8.3 Input Data -- 6.8.4 Sample Preparation and Working Procedure -- 6.8.5 Results and Discussion -- 6.8.6 Output Data -- 6.9 Case Study No. 9: MEMS Switches -- 6.9.1 Subject -- 6.9.2 Goal -- 6.9.3 Input Data -- 6.9.4 Sample Preparation -- 6.9.5 Working Procedure for FA and Results -- 6.9.6 Output Data -- 6.10 Case Study No. 10: Magnetic MEMS Switches -- 6.10.1 Subject -- 6.10.2 Goal -- 6.10.3 Input Data -- 6.10.4 Sample Preparation -- 6.10.5 Working Procedure for FA and Results -- 6.10.6 Output Data -- 6.11 Case Study No. 11: Chip-Scale Packages -- 6.11.1 Subject -- 6.11.2 Goal -- 6.11.3 Input Data -- 6.11.4 Sample Preparation -- 6.11.5 Working Procedure for FA -- 6.11.6 Results and Discussion -- 6.11.7 Output Data -- 6.12 Case Study No. 12: Solder Joints -- 6.12.1 Subject -- 6.12.2 Goal -- 6.12.3 Input Data -- 6.12.4 Sample Preparation -- 6.12.5 Working Procedure for FA and Results -- 6.12.6 Output Data -- 6.13 Conclusions -- References -- 7 Conclusions -- References -- Acronyms -- Glossary -- Index.
Abstract:
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the 'concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical,
and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Local Note:
Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2017. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries.
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