Substrate SurfacePreparation Handbook -- Contents -- Foreword -- Preface -- 1 Introduction -- 1.1 Choosing a Process -- 1.2 Definitions of Processes Used in This Book -- 1.3 Lapping, Grinding, and Polishing Abrasives -- 2 Preparation: Before the Start -- 2.1 Plates and Measurement -- 2.1.1 Plate Measurement -- 2.1.2 Maintaining Plate Shape -- 2.2 Lapping Plates -- 2.2.1 Glazing -- 2.3 Polishing Plates -- 2.4 Polishing Surfaces: Care and Conditioning -- 2.5 Baseplates for Polishing -- 2.5.1 Baseplate Materials -- 2.6 The Use of Smoothing Blocks -- 2.7 Jigs -- 2.7.1 When to Use a Jig -- 2.7.2 Jig Balance -- 2.7.3 Jig Maintenance -- 2.8 Sample Mounting -- 2.8.1 Vacuum Mounting -- 2.8.2 Wax Mounting -- 2.8. Automated Bonding -- 2.8.4 Evaporated Wax Films -- 2.8.5 Surface Tension Mounting -- 2.8.6 Epoxy Bonding -- 2.9 Sample Viewing and Assessment -- 2.10 Plate and Sample Flatness Control -- 2.10.1 Wafer Distortion -- 2.11 Conclusion -- References -- 3 Lapping -- 3.1 The Lapping Process -- 3.1.1 If the Stock Removal Is Too Slow -- 3.1.2 If the Stock Removal Is Too Fast -- 3.2 Plate Shape Monitoring -- 3.3 Scratching -- 3.4 Smoothing -- References -- 4 Polishing -- 4.1 Introduction -- 4.2 Sample Load -- 4.3 Abrasives -- 4.4 Edge Polishing -- 4.5 Slurry Flow Rate -- 4.6 Grit Sizes -- 4.7 Aligning the Sample -- 4.8 The Polishing Run -- 4.8.1 Before the Start -- 4.8.2 Monitoring Progress -- 4.9 Jig Rotation -- 4.10 Sample Surface Shape and In-Process Alignment -- 4.11 Chemical Polishing -- 4.12 Chemomechanical Polishing -- 4.13 Fluid Jet Polishing: Future Developments -- References -- 5 Specific Processes and Materials -- 5.1 Geology -- 5.2 Hard Materials -- 5.2.1 Lapping Hard Materials -- 5.2.2 Polishing Hard Materials -- 5.3 Water-Soluble Materials -- 5.4 Electro-Optic Materials -- 5.4.1 Infrared and Electro-Optic Materials.

5.4.2 Processing Infared and Electro-Optic Materials -- References -- 6 Specialized Techniques -- 6.1 Diamond Machining: Introduction -- 6.1.1 Diamond Machining of Ductile Materials -- 6.1.2 Diamond Machining of Brittle Materials -- 6.2 Sawing -- 6.2.1 Wire Saws -- 6.2.2 High-Speed Saws -- 6.2.3 Annular Saws -- References -- 7 Surface -- 7.1 The Lapped Surface Finish -- 7.2 Subsurface Damage -- 7.3 Understanding Surface Finish -- 7.3.1 Cutoff -- 7.3.2 Stylus Radius -- Reference -- 8 Optics -- 8.1 Glass -- 8.2 Processing with Pitch -- 8.3 Pitch Alternatives -- 8.4 Spherical Surfaces -- 8.5 Blocking Spherical Components -- 8.6 Specifying Diamond Tooling -- 8.7 Testing of Optical Components -- References -- 9 Semiconductor Device Deconstruction -- References -- 10 Metallurgical Polishing and Microscopy -- 10.1 Processing -- 10.1.1 Process Stages -- 10.2 Examination -- 10.3 Microscope Setup -- References -- 11 Laboratory Setup -- 11.1 Equipment Locations -- 11.2 Laboratory Layout and Dimensions -- 11.3 Optimizing the Process Route -- 11.4 Sample Cleaning -- 11.5 Safety Regulations -- 11.6 Lab Environment -- 11.7 Consumables -- References -- 12 Using Interferometry -- 12.1 Basic Principles -- 12.2 Analysis of Fringe Patterns -- 12.3 Normal and Grazing Incidence -- 12.4 Introducing the Workshop Interferometer -- References -- Bibliography -- Glossary -- References -- Appendix A: The Workshop Grazing Incidence Interferometer -- A.1 Optical Path -- A.2 Stage Mirrors and Adjustment -- A.3 Hardware and Detailed Drawings -- About the Author.