Cost-Driven Design of Smart Microsystems -- Contents -- Preface -- 1 Introduction -- References -- 2 Design Methodologies -- 2.1 Design Strategies -- 2.2 Design of Embedded Systems -- 2.2.1 Design Strategies for Digital Circuits -- 2.2.2 Design Strategies for Analog Circuits -- 2.3 Design of Electronic Components and Microsystems -- 2.4 Design of Modules with Heterogeneous Components -- 2.5 Design of Communication Protocols -- 2.6 Design Models for Smart Microsystems -- References -- 3 Fabrication Processes -- 3.1 Semiconductor Technologies -- 3.1.1 Wafer Fabrication -- 3.1.2 Wafer Test -- 3.1.3 Chip Packaging and Class Test -- 3.2 Module Integration Technologies -- 3.2.1 Fabrication of Module Substrates -- 3.2.2 Assembly and Interconnection -- 3.2.3 Passivation and Encapsulation Technologies -- 3.3 Process Modeling -- References -- 4 Physical Design Decisions -- 4.1 Basic Elements of Module Integration -- 4.1.1 Wiring Capacity of Substrates -- 4.1.2 Module Systems -- 4.2 Placement and Routing -- 4.2.1 Component Arrangement -- 4.2.2 Component Wiring -- 4.2.3 Ensuring the Signal Integrity -- 4.3 Determination of the Miniaturization Potential -- 4.3.1 Volume Aggregation Lists -- 4.3.2 Simplified Geometry Models -- 4.3.3 Adapted Geometry Models -- References -- 5 Structural Design Trade-Offs -- 5.1 Data Processing -- 5.1.1 Computing Architectures -- 5.1.2 Implementation of System Functions -- 5.2 Ambient Interface -- 5.2.1 Sensor and Actuators -- 5.2.2 Processing of Sensor Data -- 5.3 Power Supply -- 5.3.1 Power Consumption of the Functional Components -- 5.3.2 Energy Storage and Power Conversion -- 5.4 Communication Interface -- 5.4.1 Radio Architectures -- 5.4.2 Layout of Transmitter and Receiver Circuitry -- 5.5 Modeling and Simulation of System Architectures -- 5.5.1 Optimization of Analog Architectural Elements.

5.5.2 Optimization of Digital Architectural Elements -- References -- 6 Leverage Effects of the Functional Design -- 6.1 Properties of the Surrounding Medium -- 6.1.1 Concentrated and Distributed Phenomena -- 6.1.2 Signal Propagation -- 6.1.3 Interferences -- 6.1.4 Modeling of Environmental Influences -- 6.2 Radio Communications -- 6.2.1 Modulation Schemes -- 6.2.2 Media Access Schemes -- 6.2.3 Logical Link Control -- 6.2.4 Network Control -- 6.3 Distributed Data Acquisition -- 6.3.1 Localization -- 6.3.2 Synchronization and Calibration -- 6.4 Determination of Functional Optimization Potential -- 6.4.1 Aggregation Lists of System Parameters -- 6.4.2 Simplified System Models -- 6.4.3 Adapted System Models -- References -- 7 Cost Fundamentals -- 7.1 Basic Cost Categories -- 7.2 Approaches of Cost Estimation -- 7.2.1 Cost Determination of Fabrication Processes -- 7.2.2 Cost Determination of System Components -- 7.3 Direct Component Costs -- 7.3.1 Determination of Cost-Driving Function Components -- 7.3.2 Determination of Costs for Module Integration -- 7.4 Indirect Costs of Product Development -- 7.4.1 Development Effort of Hardware -- 7.4.2 Development Effort of Software -- 7.4.3 Generalized Cost Modeling of Development Activities -- 7.4.4 Influence of Expectations -- References -- 8 Cost Reduction Strategies -- 8.1 Model-Based Cost Optimization -- 8.1.1 Determination of Potential Cost Reduction -- 8.1.2 Design Flow -- 8.2 Smart Microsystems with Tailored Architectures -- 8.3 Smart Microsystems with Universal Architectures -- 8.4 Smart Microsystems with Modular Architectures -- References -- 9 Application Examples -- 9.1 Smart Microsystems for Tracking Transport Goods -- 9.1.1 Functional Design Decisions -- 9.1.2 Physical Design Decisions -- 9.2 Smart Microsystems for Condition Monitoring -- 9.2.1 Functional Design Decisions.

9.2.2 Physical Design Decisions -- Acronyms and Abbreviations -- About the Author -- Index.