Chemistry in Microelectronics.
Title:
Chemistry in Microelectronics.
Author:
Le Tiec, Yannick.
ISBN:
9781118580141
Personal Author:
Edition:
1st ed.
Physical Description:
1 online resource (386 pages)
Series:
Iste
Contents:
Title Page -- Cpntents -- Preface -- Chapter 1. Chemistry in the "Front End of the Line" (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts -- 1.1. Introduction -- 1.2. Arrangement of the gate -- 1.2.1. Generalities -- 1.2.2. Silicon nitriding processes -- 1.2.3. The introduction of the High K/metal gate stacks -- 1.2.4. Conclusion -- 1.3. Chemistry of crystalline materials -- 1.3.1. Generalities -- 1.3.2. A few basic ideas about epitaxy -- 1.3.3. Surface preparation prior to epitaxy -- 1.3.4. Low-temperature Si and SiGe growth: the comparison of three precursors (silane, disilane and dichlorosilane) -- 1.3.5. Integration and conclusion -- 1.4. Contact areas between the gate and the "source" and "drain" -- 1.4.1. Generalities -- 1.4.2. Introduction to the conventional NiSi process for sub-90 nm nodes -- 1.4.3. Implications for the SALICIDE process of the recent technology evolutions -- 1.4.4. Conclusion -- 1.5. General conclusion -- 1.6. List of Abbreviations -- 1.7. Bibliography -- Chapter 2. Chemistry in Interconnects -- 2.1. Introduction -- 2.2. Interconnects: generalities and background -- 2.2.1. What conditions are required for an interconnect? -- 2.2.2. The main technological advancements -- 2.2.3. Conclusion -- 2.3. Dielectric deposits -- 2.3.1. Dielectric generalities -- 2.3.2. Interline dielectrics -- 2.3.3. Barrier dielectrics -- 2.3.4. Conclusion -- 2.4. Deposition and properties of metal layers for interconnect structures -- 2.4.1. The manufacture of interconnect structures -- 2.4.2. The chemistry of materials and functional properties -- 2.4.3. The chemistry of interfaces -- 2.4.4. The chemistry of metal deposition processes -- 2.4.5. Conclusion -- 2.5. Cleaning process for copper interconnects -- 2.5.1. Introduction -- 2.5.2. Impact of corrosion in microelectronics -- 2.5.3. Electrochemical diagnostic tools.
2.5.4. Equipment for cleaning copper interconnections -- 2.6. General conclusions and perspectives -- 2.7. List of Abbreviations -- 2.8. Bibliography -- Chapter 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying -- 3.1. Introduction -- 3.2. Cleaning -- 3.2.1. Ammonium hydrogen peroxide mixture (APM) -- 3.2.2. Hydrochloric acid hydrogen peroxide mixture (HPM) -- 3.2.3. Sulfuric acid hydrogen peroxide mixture (SPM) -- 3.3. Wet etching -- 3.3.1. Hydrofluoric acid (HF) -- 3.3.2. Buffered oxide etchant or BOE (HF/NH4F) -- 3.4. Rinsing and drying -- 3.4.1. Ultrapure water (UPW) -- 3.4.2. Drying -- 3.5. Conclusion -- 3.6. List of Abbreviations -- 3.7. Bibliography -- Chapter 4. The Use and Management of Chemical Fluids in Microelectronics -- 4.1. Ultrapure water -- 4.1.1. Parameters of UPW -- 4.1.2. UPW system unit operations -- 4.1.3. Fundamentals -- 4.1.4. Future trends -- 4.2. Gases for semiconductors -- 4.2.1. Main gases used in the semiconductor fabrication process -- 4.2.2. Gas quality requirements for semiconductor fabrication -- 4.2.3. Implementation of gases used in the manufacturing of semiconductors -- 4.2.4. Conclusion -- 4.3. Dissolved gases -- 4.3.1. DI-O3 -- 4.3.2. DI-CO2 -- 4.3.3. DO -- 4.4. High-purity chemicals -- 4.4.1. Techniques of purification for high-purity chemicals -- 4.4.2. Handling systems for high-purity chemicals -- 4.5. Waste management -- 4.5.1. Emission guidelines -- 4.5.2. Liquid waste treatment - main technologies -- 4.5.3. Gas abatement systems -- 4.5.4. Recycling and reusing -- 4.6. List of Abbreviations -- 4.7. Bibliography -- Chapter 5. Surface Functionalization for Microand Nanosystems: Application to Biosensors -- 5.1. Introduction -- 5.2. Materials -- 5.2.1. Metal oxides and semiconductors -- 5.2.2. Carbon nanotubes and silicon nanowires -- 5.2.3. Metals -- 5.2.4. Polymers.
5.2.5. Paper and tissues -- 5.3. Functionalization process -- 5.3.1. Activation and cleaning treatments -- 5.3.2. Silanization processes -- 5.3.3. Sol-gel and polymer deposition techniques -- 5.3.4. Localization processes -- 5.4. Molecule and macromolecule immobilization -- 5.4.1. Adsorption and covalent grafting -- 5.4.2. Chemical functions for covalent grafting -- 5.4.3. Applications and examples -- 5.4.4. The chemical tool box -- 5.4.5. Applications -- 5.5. Analytes capture -- 5.5.1. Example of in vitro application -- 5.5.2. Example of in vivo application -- 5.5.3. Detection of analytes -- 5.6. Conclusion -- 5.7. List of Abbreviations -- 5.8. Bibliography -- List of Authors -- Index.
Abstract:
Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionality of circuits has increased. This book consists of five chapters covering the chemicals and sequences used in processing, from cleaning to etching, the role and impact of their purity, along with the materials used in "Front End Of the Line" which corresponds to the heart and performance of individual transistors, then moving on to the "Back End Of the Line" which is related to the interconnection of all the transistors. Finally, the need for specific functionalization also requires key knowledge on surface treatments and chemical management to allow new applications. Contents 1. Chemistry in the "Front End of the Line" (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts, François Martin, Jean-Michel Hartmann, Véronique Carron and Yannick Le Tiec. 2. Chemistry in Interconnects, Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maîtrejean and Didier Louis. 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying, Yannick Le Tiec and Martin Knotter. 4. The Use and Management of Chemical Fluids in Microelectronics, Christiane Gottschalk, Kevin Mclaughlin, Julie Cren, Catherine Peyne and Patrick Valenti. 5. Surface Functionalization for Micro- and Nanosystems: Application to Biosensors, Antoine Hoang, Gilles
Marchand, Guillaume Nonglaton, Isabelle Texier-Nogues and Francoise Vinet. About the Authors Yannick Le Tiec is a technical expert at CEA-Leti, Minatec since 2002. He is a CEA-Leti assignee at IBM, Albany (NY) to develop the advanced 14 nm CMOS node and the FDSOI technology. He held different technical positions from the advanced 300 mm SOI CMOS pilot line to different assignments within SOITEC for advanced wafer development and later within INES to optimize solar cell ramp-up and yield. He has been part of the ITRS Front End technical working group at ITRS since 2008.
Local Note:
Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2017. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries.
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Electronic Access:
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