Sputtering Materials for VLSI and Thin Film Device.
Title:
Sputtering Materials for VLSI and Thin Film Device.
Author:
Sarkar, Jaydeep.
ISBN:
9780815519874
Personal Author:
Physical Description:
1 online resource (614 pages)
Contents:
Front Cover -- Sputtering Materials for VLSI and Thin Film Devices -- Copyright Page -- Contents -- Preface -- 1 Sputtering Targets and Sputtered Films for the Microelectronic Industry -- 1.1 Materials for microelectronics -- 1.1.1 Introduction -- 1.1.1.1 Electrical conductivity -- 1.1.2 Conductors -- 1.1.3 Semiconductors -- 1.1.4 Insulators -- 1.2 Scope of sputtering in microelectronics -- 1.3 Sputtering materials for integrated circuits -- 1.3.1 Introduction -- 1.3.2 Silicide contact -- 1.3.3 Conductor, liner, barrier and anti-reflection coating -- 1.3.4 Assembly and packaging (back-end processes) -- 1.3.4.1 Under bump metallization (UBM) and bond pad -- 1.3.4.2 Through-silicon-via (TSV) -- 1.4 Sputtering materials for liquid crystal displays -- 1.4.1 Introduction -- 1.4.2 Active-matrix liquid crystal displays -- 1.4.2.1 TFT array fabrication -- 1.4.2.2 Cell assembly and Module assembly fabrication -- 1.5 Sputtering materials for magnetic storage systems -- 1.5.1 Introduction -- 1.5.2 Thin film heads -- 1.5.2.1 Inductive head -- 1.5.2.2 Magnetoresistive head (MR heads) -- 1.5.2.3 Giant magnetoresistive head (GMR head) -- 1.5.3 Magnetic recording media -- 1.6 Sputtering materials for optical storage media -- 1.7 Sputtering materials for photovoltaic devices -- 1.7.1 Silicon wafer based solar cells -- 1.7.2 Thin film solar cells -- 1.8 Sputtering target industry -- References -- 2 Sputtering and Thin Film Deposition -- 2.1 Introduction -- 2.2 Physical vapor deposition -- 2.3 Plasma and glow discharge -- 2.4 Sputter deposition of thin films -- 2.4.1 DC sputtering -- 2.4.2 RF sputtering -- 2.4.3 Reactive sputtering -- 2.4.4 Magnetron sputtering -- 2.4.4.1 Directional sputter deposition -- 2.4.4.1.1 Long-throw sputter deposition -- 2.4.4.1.2 Collimated sputter deposition -- 2.4.4.2 Ionized physical vapor deposition (I-PVD).
2.4.4.3 Hollow cathode magnetron -- 2.4.4.4 Magnetrons for large area coating -- 2.5 Thin film characteristics -- References -- 3 Performance of Sputtering Targets and Productivity -- 3.1 Introduction -- 3.2 Target chemistry -- 3.3 Target metallurgy -- 3.3.1 Grain size inhomogeneity and banding of grains -- 3.3.2 Second-phase particles, inclusions and porosity -- 3.3.3 Preferred orientation of grains -- 3.3.4 Sputter surface roughness and overall finish -- 3.3.5 Particle performance -- 3.3.6 Target bond characteristics -- 3.4 Ferromagnetic targets -- 3.5 Target cleaning and packaging -- 3.6 Target burn-in -- 3.7 Target utilization -- References -- 4 Sputtering Target Manufacturing -- 4.1 Introduction -- 4.2 Designing sputtering targets -- 4.3 Target material fabrication -- 4.3.1 Liquid metallurgy processing of targets -- 4.3.1.1 Cast structure -- 4.3.1.1.1 Phase diagram and microstructure -- 4.3.1.1.2 Melting and casting practice -- 4.3.1.2 Segregation and inclusion -- 4.3.1.3 Pipe and porosity -- 4.3.2 Powder metallurgy processing of targets -- 4.3.2.1 Powder preparation -- 4.3.2.2 Powder compaction -- 4.3.2.3 Powder consolidation using sintering -- 4.3.2.3.1 Solid phase sintering -- 4.3.2.3.2 Liquid phase sintering -- 4.3.2.3.3 Consolidation practice -- 4.3.3 Heat treatment and phase transformation -- 4.3.3.1 Solution and precipitation treatment -- 4.3.3.2 Annealing treatment -- 4.3.3.2.1 Deformed structure -- 4.3.3.2.2 Recovery -- 4.3.3.2.3 Recrystallization -- 4.3.3.2.4 Particle stimulated recrystallization -- 4.3.3.2.5 Grain growth -- 4.3.3.2.6 Continuous recrystallization -- 4.3.3.2.7 Dynamic recovery and dynamic recrystallization -- 4.3.3.3 Stress relieve heat treatment -- 4.3.4 Metal working -- 4.3.4.1 Forging -- 4.3.4.2 Rolling -- 4.3.4.3 Extrusion -- 4.4 Machining of target and backing plate -- 4.4.1 Turning, facing, milling and drilling.
4.4.2 Grinding -- 4.5 Bonding methods and bond evaluation -- 4.5.1 Braze and solder bonding -- 4.5.2 Reactive bonding -- 4.5.3 Solid-state bonding -- 4.5.3.1 Diffusion bonding -- 4.5.3.1.1 Explosive bonding -- 4.5.4 Other types of bonding -- 4.5.5 Bond evaluation -- 4.5.5.1 Ultrasonic testing for bond coverage -- 4.5.5.2 Bond strength determination -- 4.6 Particle trap formation -- 4.7 Degreasing and packaging -- References -- 5 Sputtering Targets and Thin Films for Integrated Circuits -- 5.1 Introduction -- 5.2 Titanium -- 5.2.1 Titanium processing and property control -- 5.2.1.1 Thermomechanical processing -- 5.2.1.2 Titanium target manufacturing -- 5.2.2 Titanium and titanium nitride thin films -- 5.2.2.1 Film properties -- 5.2.2.2 Defect generation -- 5.3 Tungsten -- 5.3.1 Tungsten processing and property control -- 5.3.1.1 Thermomechanical processing -- 5.3.1.2 Tungsten target manufacturing -- 5.3.2 Tungsten thin films -- 5.3.2.1 Film properties -- 5.3.2.2 Defect generation -- 5.4 Tungsten-titanium (W-Ti) alloys -- 5.4.1 Tungsten-titanium phase diagram -- 5.4.2 Tungsten-titanium processing and property control -- 5.4.2.1 Powder processing and consolidation -- 5.4.2.2 Tungsten-titanium target manufacturing -- 5.4.3 Tungsten-titanium alloy thin films -- 5.4.3.1 Film properties -- 5.4.3.2 Defect generation -- 5.5 Aluminum and its alloys -- 5.5.1 Al alloy phase diagrams -- 5.5.2 Aluminum alloy processing and property control -- 5.5.2.1 Thermomechanical processing -- 5.5.2.2 Aluminum alloy target manufacturing -- 5.5.3 Aluminum alloy thin films -- 5.5.3.1 Film properties -- 5.5.3.2 Defect generation -- 5.5.3.3 Optical properties -- 5.6 Tantalum -- 5.6.1 Tantalum processing and property control -- 5.6.1.1 Thermomechanical processing -- 5.6.1.2 Tantalum target manufacturing -- 5.6.2 Tantalum and TaN thin films -- 5.6.2.1 Film properties.
5.6.2.2 Defect generation -- 5.7 Copper and its alloys -- 5.7.1 Copper alloy phase diagrams -- 5.7.2 Copper alloy processing and property control -- 5.7.2.1 Thermomechanical processing -- 5.7.2.2 Copper alloy target manufacturing -- 5.7.3 Copper alloy thin films -- 5.7.3.1 Film properties -- 5.7.3.2 Defect generation -- 5.7.3.3 Electromigration -- 5.8 Nickel-vanadium (Ni-V) alloys -- 5.8.1 Nickel-vanadium and property control -- 5.8.1.1 Thermomechanical processing -- 5.8.1.2 Nickel-vanadium target manufacturing -- 5.8.2 Nickel-vanadium alloy thin films -- 5.9 Silicides -- 5.9.1 Polycide and salicide processes -- 5.9.2 Titanium silicides -- References -- 6 Sputtering Targets and Thin Films for Flat Panel Displays and Photovoltaics -- 6.1 Introduction -- 6.1.1 Active matrix liquid crystal displays (AMLCDs) -- 6.1.2 Photovoltaic -- 6.2 Aluminum and its alloys -- 6.2.1 Aluminum alloy phase diagrams -- 6.2.2 Aluminum alloy processing and property control -- 6.2.2.1 Thermomechanical processing -- 6.2.2.2 Aluminum alloy target manufacturing -- 6.2.3 Aluminum alloy thin films -- 6.3 Molybdenum and its alloys -- 6.3.1 Molybdenum processing and property control -- 6.3.1.1 Thermomechanical processing and heat treatment -- 6.3.1.2 Molybdenum target manufacturing -- 6.3.2 Molybdenum thin films -- 6.4 Chromium -- 6.4.1 Chromium processing and property control -- 6.4.1.1 Thermomechanical processing -- 6.4.1.2 Chromium target manufacturing -- 6.4.2 Chromium thin films -- 6.5 Transparent conducting oxides (TCOs) -- 6.5.1 Tin-doped indium-oxide (ITO) -- 6.5.1.1 ITO processing and sputtering target manufacturing -- 6.5.1.2 ITO thin films -- 6.5.2 Aluminum-doped zinc oxide (AZO) -- 6.5.2.1 AZO processing and sputtering target manufacturing -- 6.5.2.2 AZO thin films -- 6.6 Absorbers for photovoltaics -- 6.6.1 Cu(In,Ga)Se2 (CIGS).
6.6.1.1 Cu-In-Ga (CIG) and Cu-In-Ga-Se (CIGS) alloy processing -- 6.6.1.2 Sputtered CIGS thin films -- 6.6.2 Cu2ZnSnS4 (CZTS) -- References -- 7 Ferromagnetic Sputtering Targets and Thin Films for Silicides and Data Storage -- 7.1 Introduction -- 7.1.1 Magnetic properties of materials -- 7.1.2 Magnetic domain structure and hysteresis of magnetic materials -- 7.1.3 Soft and hard magnetic materials -- 7.2 Nickel and its alloys -- 7.2.1 Processing steps and property control -- 7.2.1.1 Thermomechanical processing -- 7.2.1.2 Rough machining -- 7.2.1.3 Pass-through-flux (PTF) measurement -- 7.2.1.4 Bonding, final machining, cleaning and packaging -- 7.2.2 Sputtering of nickel and thin film properties -- 7.3 Cobalt and its alloys -- 7.3.1 Processing steps and property control -- 7.3.1.1 Thermomechanical processing -- 7.3.1.2 Rough machining -- 7.3.1.3 Pass-through-flux (PTF) measurement -- 7.3.1.4 Bonding, final machining, cleaning and packaging -- 7.3.2 Sputtering of cobalt and thin film properties -- 7.4 Silicide films -- 7.5 Media for data storage -- 7.5.1 Longitudinal recording media -- 7.5.2 Perpendicular recording media -- References -- 8 Troubleshooting in Sputter Deposition -- 8.1 Introduction -- 8.2 Long burn-in of sputtering target -- 8.2.1 Inhomogeneous material -- 8.2.1.1 Inhomogeneous grain structures -- 8.2.1.2 Inhomogeneous texture in through-thickness direction -- 8.2.1.3 Inhomogeneous texture in the form of bands -- 8.2.2 Surface characteristics -- 8.2.2.1 Surface roughness and sub-surface deformed layer -- 8.2.2.2 Contaminations -- 8.3 In-film defect generation -- 8.3.1 Flaking of nodules from the sputtering target -- 8.3.2 Flaking of brittle films from the process kit -- 8.3.3 Arcing -- 8.3.4 Trace elements of sputtering target -- 8.3.5 Re-deposited material in hollow cathode magnetron (HCM) targets.
8.3.6 Contaminated particle-traps of the sputtering targets.
Abstract:
An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure,
stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. . Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements Practical information on technology trends, role of sputtering and major OEMs Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc. Practical case-studies on target performance and troubleshooting Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry.
Local Note:
Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2017. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries.
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