Compound Semiconductor Integrated Circuits.
Title:
Compound Semiconductor Integrated Circuits.
Author:
Vu, Tho T.
ISBN:
9789812796844
Personal Author:
Physical Description:
1 online resource (363 pages)
Series:
Selected Topics in Electronics and Systems ; v.29
Selected Topics in Electronics and Systems
Contents:
CONTENTS -- Preface -- Present and Future of High-Speed Compound Semiconductor IC's -- 1. Introduction -- 2. Fundamentals of Lightwave Communication ICs -- 3. Device Technology -- 4. Fundamentals of High-Speed Digital IC Design -- 5. Mixed Signal Issues in High Speed IC Design -- 6. Future Trends and Subjects -- 7. Conclusions -- References -- A Comparison of Silicon and III-V Technology Performance and Building Block Implementations for 10 and 40 Gb/s Optical Networking ICs -- 1. Introduction -- 2. Semiconductor Technologies -- 3. Building Blocks -- 4. Technology Choices -- 5. Examples of 10 and 40 Gb/s Circuits -- 6. Conclusions -- References -- The Transforming MMIC -- 1. Introduction -- 2. Transforming MMICs through Innovations in Compound Semiconductor Materials -- 3. Transforming Architectures for Real-time Adaptability -- 4. Conclusions -- Reference -- Metamorphic Low Noise Amplifiers and Optical Components -- 1. Introduction -- 2. Material Properties -- 3. Device Processing and Low Noise DC Performance -- 4. Low Noise Devices And Circuits -- 5. Power Devices -- 6. Metamorphic Optical Devices and Circuits -- 7. Reliability -- 8. Conclusion -- References -- GaAs PHEMT Chip Sets and IC Processes for High-End Fiber Optic Applications -- 1. Introduction -- 2. PHEMT and MHEMT Processes -- 3. Optical Fibre Interface Circuits -- 4. 2.5 Gb/s Transimpedance Amplifiers -- 5. 40Gb/s Transimpedance Amplifier -- 6.10 Gb/s Laser Drivers -- 7. 40Gb/s Modulator Drivers -- 8.43 Gb/s Multiplexers and Demultiplexers -- 9. Future Performance of Fiber Optic IC's and Related Processes -- 10. Conclusion -- References -- Distributed Amplifier for Fiber-Optic Communication Systems -- 1. Introduction -- 2. Conventional Distributed Amplifier Design -- 3. LiNbO3 Modulator Driver (LNDRV) -- 4. NRZ-Preamplifier -- 5. RZ-Preamplifler.
6. Over-40-Gb/s amplifier -- 7. Conclusion -- References -- The InP-HEMT IC Technology for 40-Gbit/s Optical Communications -- 1. Introduction -- 2. Optical Fiber Communication ICs -- 3. Basic Circuit Design of Source-Coupled FET Logic Inverter -- 4. High-Speed Circuit Design for Basic Communication ICs -- 5. Experimental Results for Basic Communication ICs -- 6. Highly functional InP HEMT IC -- 7. The InP HEMT IC structure -- 8. FET fabrication technology -- 9. InP-HEMT IC characteristics -- 10. Conclusions -- References -- Integrated SiGe and Si Device Capabilities and Trends for Multi-GigaHertz Applications -- 1. Introduction -- 2. Active Devices -- 3. Trench Photodiodes -- 4. Key Passive Elements for High-Frequency Operation -- 5. Substrate Effects in RF and Microwave IC Designs -- 6. Summary -- References -- High-Speed Low-Power Digital and Analog Circuits Implemented in IBM SiGe BiCMOS Technology -- 1. Introduction -- 2. Circuit design methodology -- 3. Measured performance results from the first 5HP fabrication run -- 4. Measured performance results from the second 5HP fabrication run -- 5. Measured and simulated performance results on the first 7HP fabrication run -- 6. Circuits placed on second 7HP fabrication run -- 7. SiGe BiCMOS applications -- 8. Summary -- References -- A SiGe HBT IC Chipset for 40-Gb/s Optical Transmission Systems -- 1. Introduction -- 2. SiGe HBT Technology -- 3. High-Speed ICs for Optical Transmission Systems -- 4. Summary -- References -- Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers -- 1. Introduction -- 2. Device Structure and Layout -- 3. Electrical Results -- 4. Target Applications -- 5. Conclusions -- References -- Radiation Effects in High Speed III-V Integrated Circuits -- 1. Introduction -- 2. Background -- 3. Specific Effects in III-V ICs -- References.
Radiation Effects in III-V Semiconductor Electronics -- 1. Introduction -- 2. III-V Materials and Devices -- 3. Radiation Effects -- 4. Radiation Effects in III-V Electronic Devices -- 5. Summary and Conclusions -- References -- Reliability and Radiation Hardness of Compound Semiconductors -- 1. Introduction -- 2. Background -- 3. Compound Semiconductor Construction and Physics -- 4. Reliability -- 5. Radiation Hardness -- 6. Conclusions and Future Predictions -- References.
Abstract:
This is the book version of a special issue of the International Journal of High Speed Electronics and Systems , reviewing recent work in the field of compound semiconductor integrated circuits. There are fourteen invited papers covering a wide range of applications, frequencies and materials. These papers deal with digital, analog, microwave and millimeter-wave technologies, devices and integrated circuits for wireline fiber-optic lightwave transmissions, and wireless radio-frequency microwave and millimeter-wave communications. In each case, the market is young and experiencing rapid growth for both commercial and millitary applications. Many new semiconductor technologies compete for these new markets, leading to an alphabet soup of semiconductor materials described in these papers. The book also includes three papers focused on radiation effects and reliability in III-V semiconductor electronics, which are useful for reference and future directions. Moreover, reliability is covered in several papers separately for certain process technologies. Contents: Present and Future of High-Speed Compound Semiconductor IC's (T Otsuji); The Transforming MMIC (E J Martinez); Distributed Amplifier for Fiber-Optic Communication Systems (H Shigematsu et al.); Microwave GaN-Based Power Transistors on Large-Scale Silicon Wafers (S Manohar et al.); Radiation Effects in High Speed III-V Integrated Circuits (T R Weatherford); Radiation Effects in III-V Semiconductor Electronics (B D Weaver et al.); Reliability and Radiation Hardness of Compound Semiconductors (S A Kayali & A H Johnston); and other papers. Readership: Engineers, scientists and graduate students working on high speed electronics and systems, and in the area of compound semiconductor integrated circuits.
Local Note:
Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2017. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries.
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