Cover -- Title Page -- Copyright Page -- Contents -- Preface -- Acknowledgements -- Part 1: Adhesion: Fundamentals and Measurement -- 1 Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics -- 1.1 Introduction -- 1.2 Principles of IETS -- 1.2.1 General Overview -- 1.2.2 Key Principles of Operation -- 1.2.3 IET Spectrometer Design and Implementation -- 1.2.4 IET Sample Preparation -- 1.3 Application of IETS in Microelectronics -- 1.4 Prospects -- 1.5 Summary -- References -- 2 Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics -- 2.1. Introduction -- 2.2 Mechanical Methods -- 2.2.1 Commonly Used Qualitative or Semi-quantitative Methods -- 2.2.2 Quantitative Methods -- 2.3 Laser Based Techniques -- 2.3.1 Laser Induced Delamination (LID) -- 2.3.2 Laser Direct Ablation Induced De-adhesion -- 2.3.3 Laser Spallation Technique -- 2.4 Summary and Remarks -- References -- Part 2: Ways to Promote/Enhance Adhesion -- 3 Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion -- 3.1 Introduction -- 3.1.1 Role of Surface Energy for Metal-Polymer Adhesion -- 3.1.2 Physical Effects Produced by Covalent Bonding of Metal to Polymer -- 3.1.3 Thermal Expansion Coefficients of Metals and Polymers -- 3.1.4 Differences Between Al-Polyolefin and Polyolefin-Al Laminates -- 3.1.5 Types of Covalent Metal-Polymer Bonds -- 3.1.6 Redox Reactions across the Metal-Polymer Interface -- 3.1.7 Reactions of Transition Metals with Aromatic Polymers -- 3.1.8 Loss in Anisotropic Orientation of Polymers Caused by Pretreatment or by Contact with Metals -- 3.1.9 Combination of Plasma Pretreatment and Metal Deposition -- 3.1.10 Thermodynamics -- 3.2 New Concepts for Ideal Design of Metal-Polymer Interfaces with Covalently Bonded Flexible Spacer Molecules.

3.2.1 Principal Functions of Spacers -- 3.2.2 Ways to Graft Spacer Molecules onto Polyolefin Surfaces -- 3.2.3 Grafting of Spacer Molecules onto Monotype Functional Groups at the Polyolefin Surface for Realizing New Interface Design in Metal-Polymer Systems -- 3.3 Situation at Al Oxide/Hydroxide Surfaces Using Aluminium as Substrate -- 3.4. Adhesion Promotion by Non-specific Functionalization of Polyolefin Surfaces -- 3.4.1 General -- 3.4.2 Introduction of Functional Groups onto Polyolefin Surfaces -- 3.4.3 Usual Pretreatment Processes and Their Advantages and Disadvantages -- 3.4.4 Use of Adhesion Promoting Layers Deposited by Plasma Polymerization -- 3.4.5 Use of Silanes and Siloxanes -- 3.4.6 Other Methods -- 3.5 Methods for Producing Monosort Functional Groups at Polyolefin Surfaces -- 3.5.1 Oxygen Plasma and Wet-chemical Reduction of O-functional Groups to OH Groups -- 3.5.2 Underwater Capillary Discharge Plasma or Glow Discharge Electrolysis (GDE) -- 3.5.3 Electrospray-Ionization Deposition of Ultra-thin Polymer Layers -- 3.5.4 Allylamine Plasma Polymerization for Producing NH2 Groups -- 3.5.5 Allyl Alcohol Plasma Polymerization for Producing OH Groups -- 3.5.6 Acrylic Acid Plasma Polymerization for Producing COOH Groups -- 3.5.7 Bromine Attachment onto Polypropylene Surfaces -- 3.6 Reactions and Bond Formation at the Interface -- 3.7 Grafting of Spacer Molecules at Polyolefin Surfaces -- 3.7.1 Role of Spacer Molecules along the Metal-Polymer Interface -- 3.7.2 Wet-chemical Chain Extension at Amino Groups -- 3.7.3 Spacer Grafting onto OH-groups at Polymer Surface -- 3.7.4 Spacer Anchoring onto C-Br Groups -- 3.7.5 Silane Attachment -- 3.7.6 Silane Hydrolysis -- 3.7.7 Adhesion Strength Measurements -- 3.8 Summary and Conclusions -- Acknowledgement -- References.

4 Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging -- 4.1 Introduction -- 4.2 Plasma Fundamentals -- 4.3 Survey of Vacuum Plasma Treatment of Polymers -- 4.4 Survey of Atmospheric Pressure Plasma Treatment of Polymers -- 4.5 Atmospheric Pressure Plasma Activation of Polymer Materials Relevant to Microelectronics -- 4.5.1 FR-4 Activation -- 4.5.2 Polyimide Activation -- 4.6 Vacuum Versus Atmospheric Plasmas for Use in Semiconductor Packaging -- References -- 5 Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications -- 5.1 Introduction -- 5.2 ICA Technology -- 5.3 Technology Reviews -- 5.4 Electrical Properties -- 5.4.1 Percolation -- 5.4.2 Structure -- 5.4.3 Size effect -- 5.4.4 Modeling -- 5.4.5 Measurements -- 5.4.6 High Frequency Effects -- 5.4.7 Noise -- 5.4.8 Conduction Mechanism -- 5.5 Mechanical Properties -- 5.5.1 Adhesion -- 5.5.2 Flexibility -- 5.5.3 Rheology -- 5.6 Thermal Properties -- 5.7 Metallic Filler -- 5.7.1 Surface Lubricant -- 5.7.2 Low Melting Point Alloys (LMPAs) and Fusible Filler -- 5.7.3 Nanoparticles -- 5.8 Polymer Materials -- 5.8.1 Polymer Selection -- 5.8.2 Curing -- 5.9 Reliability -- 5.9.1 Mechanical Cycling -- 5.9.2 Contact Resistance and Galvanic Corrosion -- 5.9.3 Drop Test -- 5.9.4 High Current -- 5.9.5 Ag Migration -- 5.10 Dispensation -- 5.11 Environmental Properties -- 5.12 Other Results -- 5.13 Summary -- 5.14 Prospects -- References -- Part 3: Reliability and Failure Mechanisms -- 6 Role of Adhesion Phenomenon in the Reliability of Electronic Packaging -- 6.1 Introduction -- 6.2 Hierarchy of Electronic Packaging -- 6.2.1 First Level Packaging -- 6.2.2 Second Level Packaging -- 6.2.3 Third Level Packaging -- 6.2.4 Fourth Level Packaging -- 6.2.5 Fifth Level Packaging -- 6.3 Substrates, Carriers, and Laminates.

6.3.1 Ceramic Substrates -- 6.3.2 Organic Laminates and Carriers -- 6.4 Flexible Laminates -- 6.5 First Level Packaging /Semiconductor Packaging -- 6.5.1 Ceramic Packages -- 6.5.2 Plastic Packages -- 6.6 Second Level Packaging -- 6.6.1 Alloy Interconnections -- 6.6.2 Adhesive Interconnections -- 6.7 Reliability Enhancements -- 6.7.1 Conformal Coatings -- 6.7.2 Underfills -- 6.8 Thermal Management -- 6.9 Summary -- Acknowledgements -- References -- Suggested Reading -- References -- 7 Delamination and Reliability Issues in Packaged Devices -- 7.1 Introduction -- 7.2 Basic Aspects of Delamination Failure -- 7.2.1 Delamination Process -- 7.2.2 Chip-package Interaction -- 7.2.3 Delamination Failure Modes -- 7.2.4 Impact on Reliability -- 7.3 Evaluation of Delamination Initiation in Electronic Packages -- 7.3.1 Strength-based Failure Criteria -- 7.3.2 Stress Singularity Parameter Approaches -- 7.4 Evaluation of Delamination Propagation in Electronic Packages -- 7.4.1 Linear Elastic Interface Fracture Mechanics -- 7.4.2 Fracture Mechanics Analysis of Delamination Growth -- 7.5 Summary -- References -- 8 Investigation of the Mechanisms of Adhesion and Failure in Microelectronic Packages -- 8.1 Introduction -- 8.2 Thermal Methods of Characterization -- 8.2.1 TMA - Theoretical Background -- 8.2.2 DMA - Theoretical Background -- 8.3 Stresses in Encapsulated Devices -- 8.3.1 Moisture-induced Thermal Stress in Encapsulated Devices -- 8.3.2 Thermal Stresses at Higher Temperatures -- 8.3.3 High Temperature Adhesion Studies -- 8.4 More on Adhesion of Molding Compounds -- 8.4.1 Surface Chemical and Morphological Aspects -- 8.5 Summary -- References -- Index -- EULA.