
Hermeticity Testing of MEMS and Microelectronic Packages.
Title:
Hermeticity Testing of MEMS and Microelectronic Packages.
Author:
Costello, Suzanne.
ISBN:
9781608075287
Personal Author:
Edition:
1st ed.
Physical Description:
1 online resource (197 pages)
Contents:
Contents -- Preface -- References -- Part 1 Introduction to Hermetic Package -- 1 The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication -- 1.1 Introduction -- 1.2 The Evolution of Microelectronics and MEMS Packages -- 1.3 MEMS Sealing Techniques and Mode Package Fabrication -- 1.3.1 Materials -- 1.3.2 Sealing Techniques -- 1.4 Summary of MEMS Packaging Materials and Techniques -- References -- 2 Assembly, Packaging, and Environmentally Induced Failures in MEMS -- 2.1 Introduction -- 2.2 Particle Contamination -- 2.3 Thermomechanical Constraints -- 2.3.1 Thermomechanical Constraints in Di -- 2.3.2 Thermomechanical Constraints in Pa -- 2.3.3 Thermomechanical Constraints in Wa -- 2.3.4 Thermomechanical Constraints in Fl -- 2.4 Moisture and Gas Absorption -- 2.4.1 Moisture Absorption -- 2.4.2 Barrier Coatings: A Protection Aga -- 2.4.3 Outgassing -- 2.5 Conclusions: Reliability Demonstration and Accelerated Testing -- References -- 3 Packaging Requirements for Hermeticity -- 3.1 The Need for Hermeticity in MEMS and -- 3.2 Balancing Maximum Permissive Leak Ra -- References -- 4 The Different Types of Leaks in MEMS and Microelectronics Packaging -- 4.1 Introduction -- 4.2 Leak Channels or Capillary Leaks -- 4.3 Permeation -- 4.4 Outgassing -- 4.5 Conclusion -- References -- Part 2 Traditional Hermeticity Test Techniques and Standards -- 5 Ex Situ Hermeticity Test Methods -- 5.1 Introduction -- 5.2 Fine Leak Tests -- 5.2.1 Helium Fine Leak Test -- 5.2.2 Radioisotope Leak Detection Method -- 5.3 Gross Leak Tests -- 5.3.1 Fluorocarbon Liquid and Vapor Gross Leak Detection -- 5.3.2 Gross Bubble Test -- 5.3.3 Weight Gain -- 5.3.4 Dye Penetrant Gross Leak Test -- 5.4 Combinational Tests -- 5.4.1 Optical Fine/Gross Leak Detection -- 5.4.2 Cumulative Helium Leak Detection (CHLD) Method -- References.
6 The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 1071 -- 6.1 Introduction: The First Hermeticity Tests -- 6.2 The Introduction of the Military Standards -- 6.3 The First Problems with Traditional Hermeticity Tests and Standards -- 6.4 Military Standard Revisions -- 6.5 Summary -- References -- Part 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages -- 7 Permeation -- 7.1 Introduction -- 7.2 Mathematics of Permeation -- 7.3 Limitations of the Packaging Material -- 7.4 Conclusions -- References -- 8 Outgassing and Residual Gas Analysis (RGA) -- 8.1 Outgassing -- 8.2 Residual Gas Analysis -- References -- 9 Low-Cavity Volume Capillary Leak Limitatations -- 9.1 Limitations of the Helium Fine Leak Test Method -- 9.1.1 Volume Limitations -- 9.1.2 Minimum Detectable Leak Rate -- References -- Part 4 Novel Methods of Leak Detection -- 10 Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method -- 10.1 Introduction -- 10.2 Lumped Element Modeling of a Microresonator -- 10.3 Definitions and Measurement Methods of the Quality Factor Q -- 10.3.1 Definition in Terms of Stored Energy -- 10.3.2 Definition in Terms of Bandwidth -- 10.3.3 Determination of the Q-Factor by Amplitude-Frequency Measurement -- 10.3.4 Determination of the Q-Factor by Phase Measurement -- 10.4 Relation Between Pressure and Q-Factor -- References -- 11 In Situ Test Methods in Development -- 11.1 Introduction -- 11.2 Copper Test Structures -- 11.3 Micro-Pirani Gauge -- References -- 12 Ex Situ Hermeticity Test Methods in Development -- 12.1 Introduction -- 12.2 FTIR Spectroscopy -- 12.2.1 Application to Hermeticity -- 12.2.2 Theoretical Limitations -- 12.2.3 Practical Considerations -- 12.2.4 Summary -- 12.3 Raman Spectroscopy -- 12.3.1 Application to the Hermeticity Test.
12.3.2 Theoretical Limitations -- 12.3.3 Practical Considerations -- 12.3.4 Summary -- References -- Part 5 Conclusions and Vision -- 13 Summary of Hermeticity Test Methods -- 14 The Way Forward -- 14.1 Introduction -- 14.2 Improvement on Existing Techniques -- 14.3 New Hermetic Materials and Hermeticity Test Methods -- 14.4 Conclusions -- References -- About the Authors -- Index.
Abstract:
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required.This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today's package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.
Local Note:
Electronic reproduction. Ann Arbor, Michigan : ProQuest Ebook Central, 2017. Available via World Wide Web. Access may be limited to ProQuest Ebook Central affiliated libraries.
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