Title Page -- Copyright Page -- Contents -- Preface to the Sixth Edition -- Section 1: Introduction -- The Failure Analysis Process -- Section 2: Failure Analysis Process Overviews -- System Level Failure Analysis Process: Making Failure Analysis a Value Add Proposition in Today's High Speed Low Cost PC Environment -- Board Level Failure Mechanisms and Analysis in Hand-held Electronic Products -- Failure Analysis Flow for Package Failures -- Chip-Scale Packages and Their Failure Analysis Challenges -- Wafer Level Failure Analysis Process Flow -- Failure Analysis of Microelectromechanical Systems (MEMS) -- Failure Analysis and Reliability of Optoelectronic Devices -- Solar Photovoltaic Module Failure Analysis -- DRAM Failure Analysis and Defect Localization Techniques -- Failure Analysis of Passive Components -- Section 3: Failure Analysis Topics -- Reliability and Quality Basics for Failure Analysts -- Electronics and Failure Analysis -- Submicron CMOS Devices -- Analog Device and Circuit Characterization -- Screening for Counterfeit Electronic Parts -- Section 4: Fault Verification and Classification -- An Overview of Analog Design for Test and Diagnosis -- An Overview of Integrated Circuit Testing Methods -- Diagnosis of Scan Logic and Diagnosis Driven Failure Analysis -- Interpretation of Power DMOS Transistor Characteristics Measured With Curve Tracer -- High-Volume Scan Analysis: Methods to Avoid Failure Analysis -- Differentiating between EOS and ESD Failures for ICs -- The Power of Semiconductor Memory Failure Signature Analysis -- Section 5: Localization Techniques -- Beam-Based Defect Localization Techniques -- Electron Beam Probing -- Failure Localization with Active and Passive Voltage Contrast in FIB and SEM.

Fundamentals of Photon Emission (PEM) in Silicon -Electroluminescence for Analysis of Electronic Circuit and Device Functionality -- Picosecond Imaging Circuit Analysis - PICA -- Current Imaging using Magnetic Field Sensors -- Thermal Defect Detection Techniques -- Thermal Failure Analysis by IR Lock-in Thermography -- Principles of Thermal Laser Stimulation Techniques -- Introduction to Laser Voltage Probing (LVP) of Integrated Circuits -- CAD Navigation in FA and Design/Test Data for Fast Fault Isolation -- Acoustic Microscopy of Semiconductor Packages -- Electronic Package Fault Isolation Using TDR -- Section 6: Deprocessing and Sample Preparation -- Delayering Techniques: Dry Processes, Wet Chemical Processing, and Parallel Lapping -- The Art of Cross Sectioning -- Delineation Etching of Semiconductor Cross Sections -- Special Techniques for Backside Deprocessing -- Deprocessing Techniques for Copper, Low K, and SOI Devices -- Section 7: Inspection -- Optical Microscopy -- Scanning Electron Microscopy -- Ultra-high Resolution in the Scanning Electron Microscope -- Transmission Electron Microscopy for Failure Analysis of Semiconductor Devices -- X-ray Imaging Tools for Electronic Device Failure Analysis -- Atomic Force Microscopy: Modes and Analytical Techniques with Scanning Probe Microscopy -- Section 8: Materials Analysis -- Energy Dispersive X-ray Analysis -- Analysis of Submicron Defects by Auger Electron Spectroscopy (AES) -- SIMS Solutions for Next Generation IC Processes and Devices -- Section 9: Focused Ion Beam Applications -- Focused Ion Beam (FIB) Systems: A Brief Overview -- Circuit Edit at First Silicon -- The Process of Editing Circuits Through the Bulk Silicon -- Section 10: Management and Reference Information -- Education and Training for the Analyst -- Management Principles and Practices for the Failure Analysis Laboratory.

Managing the Unpredictable - A Business Model for Failure Analysis Service -- Failure Analysis Terms and Definitions -- Author Index -- Subject Index.