Front cover -- Contents -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Become a published author -- Comments welcome -- Chapter 1. Architectural considerations -- 1.1 The connectivity conundrum -- 1.2 The first decision point -- 1.3 Asynchronous versus synchronous -- 1.4 Asynchronous transactions: A developer's view -- 1.5 z/OS concepts and terminology -- 1.6 WebSphere concepts and terminology -- 1.7 Transaction management concepts and terminology -- 1.8 WebSphere for z/OS clustering -- 1.9 WebSphere for z/OS failover and load-balancing -- 1.10 Types of WebSphere connections -- 1.11 Local connections -- 1.11.1 Local connection: Attributes -- 1.12 Remote connections -- 1.12.1 Remote connection: Attributes -- 1.13 Local connection with some availability -- 1.14 Remote connection with availability -- Chapter 2. DB2 connectivity options -- 2.1 Accessing DB2 from a Java program -- 2.2 JDBC driver types -- 2.2.1 Type 1 -- 2.2.2 Type 2 -- 2.2.3 Type 3 -- 2.2.4 Type 4 -- 2.3 Connecting from WebSphere to DB2 on z/OS -- 2.4 Different connectivity scenarios -- 2.5 Local DB2 connection -- 2.5.1 Local DB2 connection: Attributes -- 2.6 Remote DB2 connection -- 2.6.1 Remote DB2 connection: Attributes -- 2.7 Mixed DB2 configuration: local T2 and remote T4 -- 2.8 Mixed DB2 configuration: Local and remote with the same T4 driver -- 2.9 Comparing DB2 performance -- 2.10 Local DB2 with availability -- 2.11 Remote DB2 with availability -- 2.12 Security options -- 2.13 Security considerations for DB2 connections -- 2.14 Migration from legacy JDBC driver to T2 UD -- 2.15 SQLJ -- Chapter 3. CICS connectivity options -- 3.1 CICS connection architectural choices -- 3.2 The resource adapter -- 3.3 CICS Transaction Gateway -- 3.3.1 EXCI pipes -- 3.4 Local CICS connection -- 3.4.1 Local CICS connection: Attributes.

3.5 Remote connection to CICS TG in same LPAR -- 3.5.1 Remote connection to CICS TG in same LPAR: Attributes -- 3.6 Remote CICS connection -- 3.6.1 Remote CICS connection: Attributes -- 3.7 Local CICS with increased availability -- 3.7.1 Local CICS with increased availability: Attributes -- 3.8 Routing CICS local to remote -- 3.8.1 Routing CICS local to remote: Attributes -- 3.9 Remote CICS with availability -- 3.9.1 Remote CICS with availability: Attributes -- 3.10 Remote with availability using CICS routing -- 3.10.1 Remote availability with CICS routing: Attributes -- 3.11 Accessing CICS using RMI/IIOP -- 3.11.1 Accessing CICS using RMI over IIOP: Attributes -- 3.12 CICS RMI over IIOP with availability -- 3.12.1 CICS RMI/IIOP with availability: Attributes -- 3.13 SOAP connection -- 3.13.1 SOAP connection: Attributes -- Chapter 4. IMS connectivity options -- 4.1 Interface components: Resource adapter -- 4.2 Interface components: IMS Connect -- 4.3 Local IMS connection -- 4.3.1 Local IMS connection: Attributes -- 4.4 Local IMS connection in the same sysplex -- 4.4.1 Local IMS connection in same sysplex: Attributes -- 4.5 Local IMS connection: High availability -- 4.5.1 Local IMS connection with availability: Attributes -- 4.6 Remote IMS in same sysplex: Availability -- 4.6.1 Remote connection with availability: Attributes -- 4.7 Remote IMS in different sysplexes -- 4.7.1 Remote IMS in different sysplexes: Attributes -- 4.8 IMS security flow: Container-managed -- 4.9 IMS security flow: Component-managed -- 4.10 JDBC for IMS -- Chapter 5. WebSphere MQ connectivity options -- 5.1 Local MQ connectivity: Bindings mode -- 5.1.1 Binding mode: Attributes -- 5.2 Remote MQ connectivity: Client mode -- 5.2.1 Client mode: Attributes -- 5.3 WebSphere MQ connectivity with availability -- 5.4 Increasing availability with shared queues.

5.5 WebSphere MQ access to CICS and IMS -- 5.5.1 WebSphere MQ-CICS bridge -- 5.5.2 WebSphere MQ-IMS bridge -- Appendix A. Additional material -- Locating the Web material -- Using the Web material -- How to use the Web material -- Related publications -- IBM Redbooks -- Other publications -- Online resources -- How to get IBM Redbooks -- Help from IBM -- Abbreviations and acronyms -- Index -- Back cover.