Cover image for Robust design of microelectronics assemblies against mechanical schock, temperature and moisture
Robust design of microelectronics assemblies against mechanical schock, temperature and moisture
Title:
Robust design of microelectronics assemblies against mechanical schock, temperature and moisture
Author:
Wong, E- H., author.
ISBN:
9780857099112
Personal Author:
Physical Description:
1 online resource (477 pages) : illustrations (some color).
Series:
Woodhead Publishing series in electronic and optical materials, number 81

Woodhead Publishing series in electronic and optical materials ; no 81.
Local Note:
Electronic reproduction. Ann Arbor, MI : ProQuest, 2016. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
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