Wide bandgap power semiconductor packaging : materials, components, and reliability
Title:
Wide bandgap power semiconductor packaging : materials, components, and reliability
Author:
Suganuma, Katsuaki, editor.
ISBN:
9780081020951
Physical Description:
1 online resource (242 pages).
Series:
Woodhead Publishing Series in Electronic and Optical Materials
Woodhead Publishing series in electronic and optical materials.
Local Note:
Electronic reproduction. Ann Arbor, MI : ProQuest, 2018. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
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