Modeling, analysis, design, and tests for electronics packaging beyond Moore
Title:
Modeling, analysis, design, and tests for electronics packaging beyond Moore
Author:
Zhang, Hengyun, author.
ISBN:
9780081025338
Personal Author:
Physical Description:
1 online resource (436 pages).
Series:
Woodhead Publishing Series in Electronic and Optical Materials
Woodhead Publishing series in electronic and optical materials.
Local Note:
Electronic reproduction. Ann Arbor, MI : ProQuest, 2018. Available via World Wide Web. Access may be limited to ProQuest affiliated libraries.
Subject Term:
Genre:
Electronic Access:
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