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Advanced adhesives in electronics : materials, properties and applications
Title:
Advanced adhesives in electronics : materials, properties and applications
Author:
Alam, M. O.
ISBN:
9780857092892

0857092898
Publication Information:
Cambridge : Woodhead Pub., 2011.
Physical Description:
1 online resource (x, 268 pages) : illustrations
Series:
Woodhead Publishing in materials

Woodhead Publishing in materials.
Local Note:
O'Reilly
Subject Term:
Electronics -- Materials.

Coatings.

Sealing compounds.

Électronique -- Matériaux.

Revêtements.

Produits d'étanchéité.

coating (material)

caulking compound.

TECHNOLOGY & ENGINEERING -- Mechanical.

Sealing compounds. (OCoLC)fst01110294

Coatings. (OCoLC)fst00865859

Adhesive joints. (OCoLC)fst00796605

Adhesives. (OCoLC)fst00796614

Electronic packaging -- Materials. (OCoLC)fst00907419

Electronics -- Materials. (OCoLC)fst00907562
Added Author:
Alam, M. O.

Bailey, C.
Electronic Access:
https://go.oreilly.com/library-access/library/view/-/9781845695767/?ar
https://learning.oreilly.com/library/view/~/9781845695767/?ar
https://learning.oreilly.com/library/view/~/9781845695767
Holds: Copies:

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