![Cover image for Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices Cover image for Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices](/client/assets/5.1294/ctx//client/images/no_image.png)
Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices
Title:
Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices
Author:
Yeh, L.-T. (Lian-Tuu), 1944-
Personal Author:
Publication Information:
New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016) : American Society of Mechanical Engineers, 2002.
Physical Description:
1 electronic text (xxi, 414 p.) : ill., digital file.
Series:
ASME Press book series on electronic packaging
ASME Press book series on electronic packaging.
Contents:
1. Introduction -- 2. Conduction -- 3. Convection -- 4. Radiation -- 5. Pool boiling -- 6. Flow boiling -- 7. Condensation -- 8. Extended surfaces -- 9. Thermal interface resistance -- 10. Components and printed circuit boards -- 11. Direct air cooling and fans -- 12. Natural and mixed convection -- 13. Heat exchangers and cold plates -- 14. Advanced cooling technologies I: single-phase liquid cooling -- 15. Advanced cooling technologies II: two-phase flow cooling -- 16. Heat pipes -- 17. Thermoelectric coolers.
Abstract:
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.
Genre:
Added Author:
Added Corporate Author:
Electronic Access:
ASME http://ebooks.asmedigitalcollection.asme.org/book.aspx?bookid=234