Everyday heat transfer problems sensitivities to governing variables
Title:
Everyday heat transfer problems sensitivities to governing variables
Author:
Atesmen, M. Kemal.
Personal Author:
Publication Information:
New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016) : American Society of Mechanical Engineers, c2009.
Physical Description:
1 electronic text (iv, 238 p.) : ill., digital file.
Contents:
1. Heat loss from walls in a typical house -- 2. Conduction heat transfer in a printed circuit board -- 3. Heat transfer from combustion chamber walls -- 4. Heat transfer from a human body during solar tanning -- 5. Efficiency of rectangular fins -- 6. Heat transfer from a hot drawn bar -- 7. Maximum current in an open-air electrical wire -- 8. Evaporation of liquid nitrogen in a cryogenic bottle -- 9. Thermal stress in a pipe -- 10. Heat transfer in a pipe with uniform heat generation in its walls -- 11. Heat transfer in an active infrared sensor -- 12. Cooling of a chip -- 13. Cooling of a chip utilizing a heat sink with rectangular fins -- 14. Heat transfer analysis for cooking in a pot -- 15. Insulating a water pipe from freezing -- 16. Quenching of steel balls in air flow -- 17. Quenching of steel balls in oil -- 18. Cooking time for turkey in an oven -- 19. Heat generated in pipe flows due to friction -- 20. Sizing an active solar collector for a pool -- 21. Heat transfer in a heat exchanger -- 22. Ice formation on a lake -- 23. Solidification in a casting mold -- 24. Average temperature rise in sliding surfaces in contact.
Abstract:
This book uses everyday practical examples to illustrate sensitivities of heat transfer problems to governing variables in a concise and readable format. Examples include cooling of a chip, sizing a solar collector for a pool, cooking a turkey, solar tanning, ice formation on a lake, and more. This book is intended for engineering researchers and advanced students concerned with Heat Transfer problems, as well as industry professionals in a variety of settings. Professionals in electronics packaging, power generation, equipment design and manufacturing, components testing and analysis, and others, will benefit from a better understanding of applied heat transfer issues in their work.
Genre:
Added Corporate Author:
Electronic Access:
ASME http://ebooks.asmedigitalcollection.asme.org/book.aspx?bookid=290