Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices
Title:
Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices
Author:
Yeh, L.-T. (Lian-Tuu), 1944-
Personal Author:
Publication Information:
New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016) : American Society of Mechanical Engineers, 2002.
Physical Description:
1 electronic text (xxi, 414 p.) : ill., digital file.
Series:
ASME Press book series on electronic packaging
ASME Press book series on electronic packaging.
Contents:
1. Introduction -- 2. Conduction -- 3. Convection -- 4. Radiation -- 5. Pool boiling -- 6. Flow boiling -- 7. Condensation -- 8. Extended surfaces -- 9. Thermal interface resistance -- 10. Components and printed circuit boards -- 11. Direct air cooling and fans -- 12. Natural and mixed convection -- 13. Heat exchangers and cold plates -- 14. Advanced cooling technologies I: single-phase liquid cooling -- 15. Advanced cooling technologies II: two-phase flow cooling -- 16. Heat pipes -- 17. Thermoelectric coolers.
Abstract:
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.
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Electronic Access:
ASME http://ebooks.asmedigitalcollection.asme.org/book.aspx?bookid=234