Electronic Waste Management -- Contents -- Chapter 1 Introduction and Overview -- 1 Introduction -- 2 WEEE - The Scale of the Problem -- 3 Legislative Influences on Electronics Recycling -- 3.1 Producer Responsibility Legislation -- 3.2 The WEEE Directive -- 3.3 The RoHS Directive -- 3.4 Other Examples of Legislation -- 4 Treatment Options for WEEE -- 5 Material Composition of WEEE -- 6 Socio-economic Factors -- 7 Logistics of WEEE -- 8 WEEE - the International Perspective -- 8.1 European Perspective -- 8.2 Japan -- 9 Barriers to Recycling of WEEE -- 10 The Recycling Hierarchy and Markets for Recyclate -- 11 WEEE Health and Safety Implications -- 12 Future Factors That May Influence Electronic Waste Management -- 13 Summary and Conclusions -- References and Further Reading -- Chapter 2 Materials Used in Manufacturing Electrical and Electronic Products -- 1 Perspective -- 2 Impact of Legislation on Materials Used in Electronics -- 2.1 Overview -- 2.2 The RoHS Directive and Proscribed Materials -- 3 Where do RoHS Proscribed Materials Occur? -- 3.1 Lead -- 3.2 Brominated Flame Retardants -- 3.3 Cadmium, Mercury and Hexavalent Chromium -- 4 Soldering and the Move to Lead-free Assembly -- 4.1 Introduction -- 4.2 Lead-free Solder Choices -- 5 Printed Circuit Board Materials -- 5.1 Introduction -- 5.2 PCB Materials -- 5.3 Provision of Flame Retardancy in PCBs -- 5.4 Non-ferrous and Precious Metals -- 6 Encapsulants of Electronic Components -- 7 Indium Tin Oxide and LCD Screens -- 8 Polymeric Materials in Enclosures, Casings and Panels -- 8.1 Product-related Plastic Content -- 9 WEEE Engineering Thermoplastics -- 9.1 Polycarbonate (PC) -- 9.2 ABS (Acrylonitrile-Butadiene-Styrene) -- 9.3 High Impact Polystyrene (HIPS) -- 9.4 Polyphenyleneoxide (PPO) -- 9.5 PC/ABS Blends -- 9.6 Flame Retardants in Engineering Thermoplastics.

10 Materials Composition of WEEE -- 10.1 Introduction -- 10.2 Mobile Phones -- 10.3 Televisions -- 10.4 Washing Machines -- 11 Conclusions -- References -- Chapter 3 Dumping, Burning and Landfill -- 1 Introduction -- 1.1 England: Site Inputs 2002-2003 -- 1.2 Waste Inputs to Different Management Options in 2005 -- 2 Landfill -- 2.1 Historical -- 2.2 Pollution from Landfills -- 2.3 Landfill Gas -- 2.4 Leachate -- 2.5 Landfill-site Construction -- 3 Burning -- 3.1 Historical -- 3.2 Incineration -- 3.3 Mass Burn -- 3.4 Energy Recovery/Energy from Waste (EFW) -- 3.5 Advanced Thermal Processing -- 3.6 Pollution from Incineration -- 4 Legislation Summary -- 4.1 Current UK Legislation -- References -- Chapter 4 Recycling and Recovery -- 1 Introduction -- 2 Separation and Sorting -- 3 Treatment -- 3.1 Mixed WEEE -- 3.2 Refrigeration Equipment -- 3.3 Cathode Ray Tubes -- 3.4 Individual Processes -- 4 Outputs and Markets -- 4.1 Metals -- 4.2 Glass -- 4.3 Plastics -- 5 Emerging Technologies -- 5.1 Separation -- 5.2 Thermal Treatments -- 5.3 Hydrometallurgical Extraction -- 5.4 Sensing Technologies -- 5.5 Plastics to Liquid Fuel -- 5.6 Plastics Containing Brominated Flame Retardents -- 6 Acknowledgements -- References -- Chapter 5 Integrated Approach to e-Waste Recycling -- 1 Introduction -- 2 Recycling and Recovery Technologies -- 2.1 Sorting/Disassembly -- 2.2 Crushing/Diminution -- 2.3 Separation -- 3 Emerging Recycling and Recovery Technologies -- 3.1 Automated Disassembly -- 3.2 Comminution -- 3.3 Separation -- 3.4 Thermal Treatments -- 3.5 Hydrometallurgical Extraction -- 3.6 Dry Capture Technologies -- 3.7 Biotechnological Capture -- 3.8 Sensing Technologies -- 3.9 Design for Recycling and Inverse Manufacturing -- 4 Printed Circuit Boards -- 4.1 Overview -- 4.2 Recycling -- 4.3 Current Disposal Hierarchy -- 4.4 Economics of Recycling.

4.5 Future Developments -- 4.6 Characteristics of PCB Scrap -- 4.7 Emerging Technologies -- 5 Sector-based Eco-design -- 5.1 Disassembly -- 5.2 Fasteners -- 5.3 RFIDs (Radio Frequency Identification Tags) -- 5.4 Active Disassembly -- 5.5 Design Methodology and Resource Efficiency -- 5.6 Recycling -- 5.7 Constraints on Materials Selection -- 5.8 Eco-design Guidelines for Manufacturing -- References -- Chapter 6 European Recycling Platform (ERP): a Pan-European Solution to WEEE Compliance -- 1 Brief Introduction to WEEE -- 1.1 The WEEE Directive -- 1.2 Producer Responsibility -- 1.3 Household and Non-household WEEE -- 1.4 Marking EEE Products -- 1.5 WEEE Collection Points -- 1.6 Product Categories and Waste Streams -- 1.7 Producer Compliance Schemes -- 1.8 Variations in National WEEE Laws -- 2 Introduction to European Recycling Platform (ERP) -- 2.1 European Recycling Platform -- 2.2 Founder Members -- 2.3 Timeline -- 2.4 Founding Principles -- 2.5 Structure -- 2.6 Scope of services -- 2.7 The Operational Model - General Contractor Approach -- 2.8 Euro PLUS -- 3 ERP in Operation -- 3.1 Country Summaries -- 3.2 Key Performance Indicators -- 3.3 Members -- 4 ERP - Beyond Compliance -- 4.1 Implementation of Individual Producer Responsibility (IPR) -- 4.2 ERP UK WEEE Survey -- 5 Summary -- 5.1 Key Achievements -- 5.2 Final Thoughts: Interviews with Two Founding Members -- References -- Chapter 7 Liquid Crystal Displays: from Devices to Recycling -- 1 Introduction -- 2 Overview of Liquid Crystals -- 2.1 Definition and Classification of Liquid Crystals -- 2.2 Molecular and Chemical Architecture of Liquid Crystals -- 2.3 The Mesophase: Types of Intermediate State of Matter -- 2.4 Physical Properties of Liquid Crystals and Material Requirements -- 3 Overview of Liquid Crystal Displays Based on Nematic Mesophase -- 3.1 Basic LCD Operating Principles.

3.2 Types of Electro-optic LCD Devices -- 4 LCD Manufacturing Process -- 5 Environmental Legislation and Lifecycle Analysis -- 5.1 The WEEE Directive and LCDs -- 5.2 RoHS and REACH -- 5.3 Far East Environmental Measures -- 5.4 Lifecycle Analysis -- 6 Potentially Hazardous Constituents: Toxicity of LCD Constituents -- 6.1 Toxicity of Mercury and Backlighting -- 6.2 Toxicity of Liquid-crystal Mixture -- 6.3 Demanufacture and Recycling -- 7 Future Outlook -- 7.1 LCD Panels -- 7.2 Smart Disassembly -- 7.3 Legislation -- References -- Chapter 8 The Role of Collective versus Individual Producer Responsibility in e-Waste Management: Key Learnings from Around the World -- 1 Introduction -- 1.1 E-waste and Its Environmental Impacts -- 1.2 Background to Producer Responsibility -- 1.3 Defining Individual and Collective Producer Responsibility -- 2 The WEEE Directive in Europe -- 2.1 The WEEE Directive's Approach to Individual and Collective Producer Responsibility -- 2.2 Implementation of Individual and Collective Producer Responsibility in the EU -- 2.3 ICT Milieu, The Netherlands -- 3 E-waste Laws and Voluntary Agreements in Other Countries -- 3.1 Japanese Electronics Take-back Directive -- 3.2 Product Take-back in the USA -- 3.3 Product Stewardship in Australia -- 4 Discussion -- 4.1 Competition in E-Waste Management -- 4.2 Collective Producer Responsibility: Benefits and Disadvantages -- 4.3 Individual Producer Responsibility: Benefits and Disadvantages -- 4.4 Evaluating Collective versus Individual Producer Responsibility -- 5 Recommendations to Implement IPR -- 5.1 Recommendation #1: Ensure Article 8.2 of the WEEE Directive is Fully Transposed -- 5.2 Recommendation #2: Adopt a Phased Approach to IPR -- 5.3 Recommendation #3: Member States to Implement IPR -- 6 Conclusions -- References -- Chapter 9 Rapid Assessment of Electronics Enclosure Plastics.

1 Introduction -- 2 Instrumental Techniques -- 3 Visible-NIR Spectroscopy of Engineering Thermoplastics -- 3.1 Discrimination of Enclosure Materials -- 3.2 Base Polymer Identification -- 3.3 Selected Thermoplastics for Processing -- 3.4 Controlled Degradation Experiments -- 3.5 Analysis of Processed Thermoplastics -- 4 Analysis of Plastics Containing Flame-retardant Additives -- 4.1 Visible-NIR Spectroscopy -- 4.2 X-Ray Fluorescence and Optical Emission Spectroscopy -- 4.3 Infrared and Raman Spectroscopy -- 5 Conclusions -- References -- Subject Index.