Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Title:
Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Author:
Díaz-Díaz, Ana
Personal Author:
Publication Information:
Cambridge, MA MyJoVE Corp 2016
Physical Description:
online resource (546 seconds)
Series:
Engineering
General Note:
Title from resource description page
Abstract:
An experimental methodology based on thermal and rheological measurements is proposed to characterize the curing process of adhesives with to obtain useful information for industrial adhesive selection.
Reading Level:
For undergraduate, graduate, and professional students
Subject Term:
Electronic Access:
https://www.jove.com/t/61468