Adhesives technology for electronic applications materials, processes, reliability
Title:
Adhesives technology for electronic applications materials, processes, reliability
Author:
Licari, James J., 1930-
ISBN:
9780815515135
9781591249429
9780080947167
9780815516002
Personal Author:
Publication Information:
Norwich, NY : William Andrew Pub., ©2005.
Physical Description:
1 online resource (xvi, 459 pages) : illustrations.
Series:
Materials and processes for electronic applications series
Materials and processes for electronic applications series.
Contents:
Introduction -- Functions and Theory of Adhesives -- Chemistry, Formulation, and Properties of Adhesives -- Adhesive Bonding Properties -- Applications -- Reliability -- Test and Inspection Methods -- Appendix -- Conversion Factors -- Abbreviations and Acronyms -- Index.
Abstract:
This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.
Local Note:
Knovel Library
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