EMI Protection forCommunication Systems -- Contents -- Preface -- Chapt er 1 Communications Systems -- 1.1 Components of Communications Systems -- 1.2 Transmitter Systems -- 1.2.1 Transmitter -- 1.2.2 Randomization -- 1.2.3 Encryption -- 1.2.4 Encoder -- 1.2.5 Interleaving -- 1.2.6 Modulation -- 1.2.7 Mixer (Upconverter) -- 1.2.8 Filter -- 1.3 Receiver Systems -- 1.3.1 Filter -- 1.3.2 Mixer (Downconverter) -- 1.3.3 Demodulator -- 1.3.4 Deinterleaver -- 1.3.5 Decoder -- 1.3.6 Decryptor -- 1.3.7 Derandomizer -- 1.3.8 Demultiplexer -- 1.3.9 Received Power -- 1.4 User Interface -- 1.4.1 Graphical User Interface (GUI) -- 1.4.2 Voice User Interface (VOI) -- 1.5 Antenna Systems -- 1.5.1 Duplexer -- 1.5.2 Antenna -- 1.6 Power Supplies -- 1.6.1 Power Supply Types -- 1.6.2 Power Amplifier -- 1.7 Considerations for Voice Versus Data -- 1.7.1 Text -- 1.7.2 Images -- 1.7.3 Voice -- 1.7.4 Video -- Selected Bibliography -- Chapter 2 Electromagnetic Spectrum Used forCommunications -- 2.1 Electromagnetic Spectrum -- 2.1.1 Extra Low Frequency (ELF) -- 2.1.2 Super Low Frequency (SLF) -- 2.1.3 Ultra Low Frequencies (ULF) -- 2.1.4 Very Low Frequency (VLF) -- 2.1.5 Low Frequency (LF) -- 2.1.6 Medium Frequency (MF) -- 2.1.7 High Frequency (HF) -- 2.1.8 Very High Frequency (VHF) -- 2.1.9 Ultra High Frequency (UHF) -- 2.1.10 Super High Frequency (SHF) -- 2.1.11 Extra High Frequency (EHF) -- 2.1.12 Infrared (IR) -- 2.1.13 Visible -- 2.2 Spectrum Division -- Selected Bibliography -- Chapter 3 Electromagnetic Properties ofCommunications Systems -- 3.1 Fundamental Communications System Electromagnetics -- 3.1.1 Smith Chart -- 3.1.2 Snell's Law of Reflection and Refraction -- 3.2 Wave Generation and Propagation in Free Space -- 3.2.1 Maxwell's Equations -- 3.2.2 Wave Propagation -- 3.2.3 Wave Polarization -- 3.2.4 Fresnel Knife-Edge Diffraction -- 3.2.5 Path Loss Prediction.

3.3 Wave Generation and Propagation in the Terrestrial Atmosphere -- 3.3.1 Absorption and Scattering -- 3.3.2 Wave Propagation in the Atmosphere -- Selected Bibliography -- Chapter 4 Electromagnetic Interference -- 4.1 Electromagnetic Interference with Wave Propagation and Reception -- 4.1.1 Additive White Gaussian Noise (AWGN) -- 4.1.2 Thermal Noise -- 4.1.3 Shot Noise -- 4.1.4 Flicker (1/f ) Noise -- 4.1.5 Burst Noise -- 4.1.6 Noise Spectral Density -- 4.1.7 Effective Input Noise Temperature -- 4.2 Natural Sources of Electromagnetic Interference -- 4.2.1 Lightning and Electrostatic Discharge -- 4.2.2 Multipath Effects Caused by Surface Feature Diffraction and Attenuation -- 4.2.3 Attenuation by Atmospheric Water -- 4.2.4 Attenuation by Atmospheric Pollutants -- 4.2.5 Sunspot Activity -- 4.3 Manmade Sources of Electromagnetic Interference -- 4.3.1 Commercial Radio and Telephone Communications -- 4.3.2 Military Radio and Telephone Communications -- 4.3.3 Commercial Radar Systems -- 4.3.4 Industrial Sources -- 4.3.5 Intentional Interference -- Selected Bibliography -- Chapter 5 Filter Interference Control -- 5.1 Filters -- 5.1.1 Lowpass Filter -- 5.1.2 Highpass Filter -- 5.1.3 Bandpass Filter -- 5.1.4 Bandstop Filter -- 5.1.5 Resonator -- 5.2 Analog Filters -- 5.2.1 Butterworth Filter -- 5.2.2 Chebyshev Filters -- 5.2.3 Bessel Filters -- 5.2.4 Elliptic Filters -- 5.2.5 Passive Filters -- 5.2.6 Active Filters -- 5.3 Digital Filters -- 5.3.1 FIR Filters -- 5.3.2 IIR Filters -- 5.4 Microwave Filters -- 5.4.1 Lumped-Element Filters -- 5.4.2 Waveguide Cavity Filters -- 5.4.3 Dielectric Resonator -- Selected Bibliography -- Chapter 6 Modulation Techniques -- 6.1 Signal Processing and Detection -- 6.2 Modulation and Demodulation -- 6.2.1 Analog Modulations -- 6.2.2 Digital Modulation -- 6.3 Control of System Drift -- Selected Bibliography.

Chapter 7 Electromagnetic Field Coupling to Wire -- 7.1 Field-to-Wire Coupling -- 7.1.1 Skin Effect -- 7.1.2 Unshielded Twisted Pair (UTP) -- 7.1.3 Ferrite Filter -- 7.2 Electric Field Coupling to Wires -- 7.3 Magnetic Field Coupling to Wires -- 7.4 Cable Shielding -- 7.4.1 Tri-Axial Cable -- 7.4.2 Cable Termination -- 7.4.3 Shielded Twisted Pair Cables -- Selected Bibliography -- Chapter 8 Electromagnetic Field-to-ApertureCoupling -- 8.1 Field-to-Aperture Coupling -- 8.1.1 Shielding Effectiveness (SE) -- 8.1.2 Multiple Apertures -- 8.1.3 Waveguides Below Cutoff -- 8.2 Reflection and Transmission -- 8.2.1 Electric Field -- 8.2.2 Magnetic Field -- 8.3 Equipment Shielding -- 8.3.1 Gasketing -- 8.3.2 PCB Protection -- 8.3.3 Magnetic Shield -- Selected Bibliography -- Chapter 9 Electrical Grounding and Bonding -- 9.1 Grounding for Safety -- 9.1.1 Shock Control -- 9.1.2 Fault Protection -- 9.2 Grounding for Voltage Reference Control -- 9.2.1 Floating Ground -- 9.2.2 Single Point Ground -- 9.2.3 Multipoint Ground -- 9.2.4 Equipotential Plane -- 9.3 Bonding for Current Control -- 9.3.1 Bonding Classes -- 9.3.2 Strap Bond for Class R -- 9.3.3 Resistance Requirements -- 9.4 Types of Electrical Bonds -- 9.4.1 Welding and Brazing -- 9.4.2 Bolting -- 9.4.3 Conductive Adhesive -- 9.5 Galvanic (Dissimilar Metal) Corrosion Control -- Selected Bibliography -- Chapter 10 Emissions and Susceptibility-Radiatedand Conducted -- 10.1 Control of Emissions and Susceptibility-Radiated andConducted -- 10.1.1 Sources of Electromagnetic Interference -- 10.1.2 Test Requirements for Emission and Susceptibility -- 10.1.3 Standard Organizations -- 10.2 Commercial Requirements -- 10.3 Military Requirements -- 10.3.1 Specific Conducted Emissions Requirements Mil-Std 461E -- 10.3.2 Specific Conducted Susceptibility Requirements Mil-Std 461E.

10.3.3 Radiated Emissions Requirements Mil-Std 461E -- 10.3.4 Radiated Susceptibility Requirements Mil-Std 461E -- Selected Bibliography -- Chapter 11 Measurement Facilities -- 11.1 Full Anechoic and Semianechoic Chambers -- 11.1.1 Absorbers -- 11.1.2 Ferrite Tiles -- 11.2 Open Area Test Site (OATS) -- 11.3 Reverberation Chamber -- 11.4 TEM Cell -- 11.4.1 Characteristic Impedance -- 11.4.2 Higher-Order Modes -- 11.4.3 TEM Cell Construction -- 11.4.4 Parameter Measurements -- 11.5 GTEM Cell -- 11.5.1 GTEM Cell Characteristics -- 11.5.2 GTEM Cell Construction -- 11.5.3 GTEM Cell Parameter Measurement -- 11.5.4 Current Distribution at Septum -- Selected Bibliography -- Chapter 12 Typical Test Equipment -- 12.1 LISN-Line Impedance Stabilization Network -- 12.2 Coupling Capacitor -- 12.3 Coupling Transformer -- 12.4 Parallel Plate for Susceptibility Test -- 12.5 Coupling Clamps and Probes -- 12.5.1 Capacitive Coupling Clamp -- 12.5.2 Current Probe -- 12.6 Injection Clamps and Probes -- 12.6.1 Current Injection Probe -- 12.6.2 EM Clamp -- 12.6.3 Electrostatic Discharge (ESD) Generator -- 12.7 EMI Receiver -- 12.8 Spectrum Analyzer -- 12.9 Oscilloscopes -- Selected Bibliography -- Chapter 13 Control of Measurement Uncertainty -- 13.1 Evaluation of Standard Uncertainty -- 13.1.1 Type A Evaluation of Standard Uncertainty -- 13.1.2 Type B Evaluation of Standard Uncertainty -- 13.2 Distributions -- 13.2.1 Normal (Gaussian) Distribution -- 13.2.2 Rectangular Distribution -- 13.2.3 U-Shaped Distribution -- 13.2.4 Combined Standard Uncertainty -- 13.2.5 Expanded Uncertainty -- 13.3 Sources of Error -- 13.3.1 Stability -- 13.3.2 Environment -- 13.3.3 Calibration Data -- 13.3.4 Resolution -- 13.3.5 Device Positioning -- 13.3.6 RF Mismatch Error -- 13.4 Definitions -- Selected Bibliography -- Appendix A Communication Frequency Allocations.

Appendix B List of EMC Standards Regarding Emission and Susceptibility -- Acronyms and Abbreviations -- Glossary -- About the Author -- Index.