Cover image for Bond characteristics of overlays placed over bridge decks sealed with HMWM or epoxy
Bond characteristics of overlays placed over bridge decks sealed with HMWM or epoxy
Title:
Bond characteristics of overlays placed over bridge decks sealed with HMWM or epoxy
Author:
Gillum, Arnol J.
Publication Information:
Cincinnati, Ohio : Cincinnati Infrastructure Institute ; [Springfield, Va. : Available through the National Technical Information Service, 1998]
Physical Description:
xii, 179 p. : ill. ; 28 cm.
Series:
Report ; no. UC-CII 98/02.

Report (Cincinnati Infrastructure Institute) ; no. UC-CII 98/02.
General Note:
Author listed on technical rept. documentation page: Bahram M. Shahrooz.

"July 1998."
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