Microelectromechanical Systems -- Copyright -- Acknowledgments -- Preface -- Contents -- Acronyms -- Executive Summary -- LEVERAGING AND EXTENDING THE INTEGRATED CIRCUITS FOUNDATION -- ENLARGING THE SUITE OF MATERIALS SUITABLE FOR INTEGRATED-CIRCUIT-LIKE PROCESSING -- CHARACTERIZING MEMS MATERIALS -- UNDERSTANDING SURFACE AND INTERFACE EFFECTS -- ETCHING TECHNOLOGIES -- ESTABLISHING STANDARD TEST DEVICES AND METHODS -- MEMS PACKAGING -- FOUNDRY AND COMPUTER-AIDED DESIGN INFRASTRUCTURE FOR MEMS -- ACADEMIC STRUCTURE TO SUPPORT MEMS -- 1 Background -- COMMERCIAL SUCCESSES -- Thermal Ink-Jet Printing -- Accelerometers -- NEWLY INTRODUCED PRODUCTS -- High-Resolution Displays -- Chemical-Sensing Arrays -- LONGER-RANGE OPPORTUNITIES -- Transportation -- Biomedical and Health Care -- Information Technology -- Defense -- SUMMARY -- 2 Integrated Circuit-Based Fabrication Technologies and Materials -- STRENGTHS OF THE INTEGRATED CIRCUIT PROCESS -- USING EXISTING INTEGRATED CIRCUIT-BASED PROCESSES -- Bulk Micromachining Processes -- Bulk Micromachining for MEMS with Electronics -- Surface Micromachining Processes -- Surface Micromachining to Produce Multilevel MEMS -- CLASSIFYING INTEGRATED CIRCUIT-BASED TECHNOLOGIES -- MEMS with Old Materials and Old Tools -- MEMS with Old Materials and New Tools -- MEMS with New Materials and Old Tools -- MEMS with New Materials and New Tools -- SUMMARY -- 3 New Materials and Processes -- MOTIVATIONS FOR NEW TECHNOLOGIES -- MATERIALS AND PROCESSES FOR HIGH-ASPECT-RATIO STRUCTURES -- HEXSIL -- LIGA -- Compatibility and Manufacturing Constraints of LIGA -- MATERIALS AND PROCESSES FOR ENHANCED-FORCE MICROACTUATION -- Materials -- Magnetic Thin-Films -- Piezoelectric Films -- Shape-Memory Alloys -- Shape-Memory Polymers -- Magnetostrictive Alloys -- Processing -- Processing Multilayer Ceramics -- Thin-Film Processing.

FILMS FOR USE IN SEVERE ENVIRONMENTS: SILICON CARBIDE AND DIAMOND -- Silicon Carbide -- Diamond -- SURFACE MODIFICATIONS/COATINGS -- Plasma-Deposited Polymers -- Polyimides -- Conducting Polymers -- POWER SUPPLIES -- SUMMARY -- 4 Designing Microelectromechanical Systems -- METROLOGY -- MODELING -- COMPUTER-AIDED DESIGN SYSTEMS -- FOUNDRY INFRASTRUCTURE -- SUMMARY -- 5 Assembly, Packaging, and Testing -- CONTRASTS BETWEEN ASSEMBLY, PACKAGING, AND TESTING OF INTEGRATED CIRCUITS AND MICROELECTROMECHANICAL... -- INTERFACES -- Biomedical Interfaces -- Optical Interfaces -- Electrical Power -- Fluidics -- Mechanical Interfaces -- PACKAGING -- Handling Issues -- Dicing -- Cleanliness -- Stiction -- Packaging Materials -- Stresses on Packaging -- Fluid Environment -- Vacuum Packaging -- ASSEMBLY -- Hybrid Assembly -- Assembly of Micromechanical Parts -- STANDARDS, TESTING, AND RELIABILITY -- FAILURE ANALYSIS -- SUMMARY -- References -- APPENDICES -- Appendix A World Wide Web Sites on MEMS -- Appendix B Biographical Sketches of Committee Members.