Cover image for Proceedings the 3rd International Symposium on Information Engineering and Electronic Commerce, IEEC 2011 : 22-24 July 2011, Huangshi, China
Proceedings the 3rd International Symposium on Information Engineering and Electronic Commerce, IEEC 2011 : 22-24 July 2011, Huangshi, China
Title:
Proceedings the 3rd International Symposium on Information Engineering and Electronic Commerce, IEEC 2011 : 22-24 July 2011, Huangshi, China
Author:
International Symposium on Information Engineering and Electronic Commerce (3rd : 2011 : Huangshi Shi, China)
Publication Information:
New York, N.Y. (ASME, Three Park Avenue. New York, NY 10016) : American Society of Mechanical Engineers, c2011.
Physical Description:
1 electronic text (544 p.) : ill., digital file.
Abstract:
This conference serves as a forum for researchers, industry professionals, and academics interested in Information Engineering and Electronic Commerce, with the goal of fostering interaction among these groups. The conference was organized by Huangshi Institute of Technology, and sponsored by Ternopil National Economic University of the Ukraine, Huazhong University of Science and Technology, Wuhan University, Harbin Institute of Technology, and Research Association of Modern Education and Computer Science.
Holds: Copies: