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Characterization of integrated circuit packaging materials
Title:
Characterization of integrated circuit packaging materials
Author:
Moore, Thomas M.
ISBN:
9781483292342
Publication Information:
Boston : Butterworth-Heinemann, ©1993.
Physical Description:
1 online resource (xviii, 274 pages) : illustrations
Series:
Materials characterization series

Materials characterization series.
Local Note:
O'Reilly
Subject Term:
Electronic packaging -- Materials.

Integrated circuits -- Design and construction.

TECHNOLOGY & ENGINEERING -- Mechanical.

Electronic packaging -- Materials. (OCoLC)fst00907419

Integrated circuits -- Design and construction. (OCoLC)fst00975545

Mise sous boîtier (Électronique) -- Matériaux.

Circuits intégrés -- Conception et construction.
Genre:
Electronic books.
Added Author:
Moore, Thomas M.

McKenna, Robert G.
Electronic Access:
https://go.oreilly.com/library-access/library/view/-/9781483292342/?ar
https://learning.oreilly.com/library/view/~/9781483292342
https://learning.oreilly.com/library/view/~/9781483292342/?ar
Holds: Copies:

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