Materials for High-Density Electronic Packaging and Interconnection -- Copyright -- Abstract -- Preface -- Acknowledgments -- MEETING 1 -- MEETING 2 -- MEETING 3 -- Contents -- Executive Summary -- Chapter 1 Introduction -- Chapter 2 Microelectronic System Trends and Packaging Needs -- SCALING THEORY -- Lithography -- Scaling of Mosfets -- Scaling of CMOS -- Scaling of Bipolars -- GALLUM ARSENIED TECHNOLOGY -- RENT'S RULE -- CHIP TECHNOLOGIES -- Chip Interface Packaging -- Chip Interconnection Packaging -- SOME PACKAGE DESIGN CONSIDERATIONS -- Single-Chip Modules -- Multichip Modules -- REFERENCES -- Chapter 3 Packaging Strategies and Associated Materials and Process Requirements -- PRESENT PACKAGING APPROACHES -- Single-Chip Modules on Printed Wiring Boards -- Thick-Film Multichip Modules Using Ceramic Dielectrics -- FUTURE PACKAGING STRATEGIES -- Thin-Film Multichip Modules Using Polymeric Dielectrics -- References for Table 3-1: -- Wafer-Scale Integration -- PACKAGING MATERIALS REQUIREMENTS -- SUMMARY OF FUTURE PACKAGING MATERIALS AND PROCESSES NEEDS -- Chapter 4 Materials Issues -- DISSIPATION OF HIGH THERMAL LOADS -- DIELECTRIC PROPERTIES -- INTERCONNECT VOIDING -- THERMAL FATIGUE -- INTERFACIAL PROCESSES -- HIGH-TEMPERATURE STABILITY AND CHEMICAL REACTIONS -- TRACE RADIONUCLIDES IN PACKAGING MATERIALS -- ELECTROMAGNETIC INTERFERENCE -- ENCAPSULANTS AND HERMETICITY -- MATERIALS-RELATED RELIABILITY ISSUES -- MILITARY PACKAGING -- REFERENCES -- Chapter 5 Some Specific Materials -- THE EVOLUTION OF EPOXY MATERIALS IN PLASTIC PACKAGING -- Epoxy Versus Silicone Materials -- Low-Stress Materials -- Low-Alpha Materials -- Processing Improvements -- Market Shares of the Major Molding Compound Suppliers -- FUTURE TRENDS IN PLASTIC PACKAGING MATERIALS -- Surface-Mount Technology -- Very High Pin Count Packages -- Heat Dissipation.

Plastic Alternatives to Epoxy Encapsulation -- ORGANIC PRINTED CIRCUIT BOARD MATERIALS -- PROCESSING TECHNOLOGY FOR CERAMIC PACKAGES, BOARDS, AND SUBSTRATES -- Dry Pressing -- The Ceramic Tape Process -- Screen Printing -- OTHER CERAMIC MATERIALS -- Glass and Porcelain -- Low-Fire Materials -- Low-Dielectric-Constant Materials -- High-Thermal-Conductivity Materials -- POLYIMIDES IN HIGH-DENSITY PACKAGING -- Trends in High-Density Packaging -- Polyimide Processing -- Polyimides and Properties for High-Density Interconnection -- Photosensitive Polyimides -- General Availability of Technical Information on Polyimides -- Polymers in Future High-Density Interconnection Technologies -- TAPE AUTOMATED BONDING -- DIAMOND -- SUPERCONDUCTORS -- COMPOSITES -- MATERIALS FOR VERY-HIGH-FREQUENCY DIGITAL SYSTEMS -- MATERIALS FOR CONNECTOR APPLICATIONS -- THE THERMAL CONDUCTION MODULE -- REFERENCES -- Chapter 6 Organizational, Funding, and Policy Issues -- INTEGRATION -- SYSTEMS VERSUS MATERIALS APPROACHES -- PROGRAMS AND CONSORTIA -- Very-High-Speed Integrated Circuits (VHSIC) -- Microwave and Millimeter-Wave Monolithic Integrated Circuits (MIMIC) -- Semiconductor Research Corporation (SRC) -- Microelectronics and Computer Technology Corporation (MCC) -- SEMATECH -- Other Considerations -- THE UNIVERSITY ROLE -- EMIGRATION OF TECHNOLOGY -- PRIVATE FUNDING AND PUBLIC FUNDING -- CONCLUSION -- Appendix A Glossary of Some Terms and Acronyms Used in This Report -- Appendix B Some Industry Component Data -- Appendix C Microprocessor Operating and Structural Parameters -- Appendix D Examples of Developments in Board Technologies -- Appendix E Materials Properties -- Appendix F Examples of Multichip Modules -- Appendix G Biographical Sketches of Committee Members.