DIGITAL CIRCUIT BOARDS -- CONTENTS -- Preface -- 1 BASICS -- 1.1 Introduction -- 1.2 Why the Field Approach is Important -- 1.3 The Role of Circuit Analysis -- 1.4 Getting Started -- 1.5 Voltage and the Electric Field -- 1.6 Current -- 1.7 Capacitance -- 1.8 Mutual and Self-Capacitance -- 1.9 E Fields Inside Conductors -- 1.10 The D Field -- 1.11 Energy Storage in a Capacitor -- 1.12 The Energy Stored in an Electric Field -- 1.13 The Magnetic Field -- 1.14 Rise Time/Fall Time -- 1.15 Moving Energy into Components -- 1.16 Faraday's Law -- 1.17 Self- and Mutual Inductance -- 1.18 Poynting's Vector -- 1.19 Fields at DC -- Glossary -- 2 TRANSMISSION LINES -- 2.1 Introduction -- 2.2 Some Common Assumptions -- 2.3 Transmission Line Types -- 2.4 Characteristic Impedance -- 2.5 Wave Velocity -- 2.6 Step Waves on a Properly Terminated Line -- 2.7 The Open Circuited Transmission Line -- 2.8 The Short Circuited Transmission Line -- 2.9 Waves that Transition between Lines with Different Characteristic Impedances -- 2.10 Nonlinear Terminations -- 2.11 Discharging a Charged Open Transmission Line -- 2.12 Ground/Power Planes -- 2.13 The Ground and Power Planes as a Tapered Transmission Line -- 2.14 Pulling Energy from a Tapered Transmission Line (TTL) -- 2.15 The Energy Flow Through Cascaded (Series) Transmission Lines -- 2.16 An Analysis of Cascaded Transmission Lines -- 2.17 Series (Source) Terminating a Transmission Line -- 2.18 Parallel (Shunt) Terminations -- 2.19 Stubs -- 2.20 Decoupling Capacitor as a Stub -- 2.21 Transmission Line Networks -- 2.22 The Network Program -- 2.23 Measuring Characteristic Impedance -- Glossary -- 3 RADIATION AND INTERFERENCE COUPLING -- 3.1 Introduction -- 3.2 The Nature of Fields in Logic Structures -- 3.3 Classical Radiation -- 3.4 Radiation from Step Function Waves -- 3.5 Common Mode and Normal Mode.

3.6 The Radiation Pattern along a Transmission Line -- 3.7 Notes on Radiation -- 3.8 The Cross Coupling Process (Cross Talk) -- 3.9 Magnetic Component of Cross Coupling -- 3.10 Capacitive Component of Cross Coupling -- 3.11 Cross Coupling Continued -- 3.12 Cross Coupling between Parallel Transmission Lines of Equal Length -- 3.13 Radiation from Board Edges -- 3.14 Ground Bounce -- 3.15 Susceptibility -- Glossary -- 4 ENERGY MANAGEMENT -- 4.1 Introduction -- 4.2 The Power Time Constant -- 4.3 Capacitors -- 4.4 The Four-Terminal Capacitor or DTL -- 4.5 Types of DTLs -- 4.6 Circuit Board Resonances -- 4.7 Decoupling Capacitors -- 4.8 The Board Decoupling Problem -- 4.9 The IC Decoupling Problem -- 4.10 Comments on Energy Management -- 4.11 Skin Effect -- 4.12 Dielectric Losses -- 4.13 Split Ground/Power Planes -- 4.14 The Analog/digital Interface Problem -- 4.15 Power Dissipation -- 4.16 Traces through Conducting Planes -- 4.17 Trace Geometries that Reduce Termination Resistor Counts -- 4.18 The Control of Connecting Spaces -- 4.19 Another way to look at Energy Flow in Transmission Lines -- Glossary -- 5 SIGNAL INTEGRITY ENGINEERING -- 5.1 Introduction -- 5.2 The Envelope of Permitted Logic Levels -- 5.3 Net Lists -- 5.4 Noise Budgets -- 5.5 Logic Level Variation -- 5.6 Logic and Voltage Drops -- 5.7 Measuring the Performance of a Net -- 5.8 The Decoupling Capacitor -- 5.9 Cross Coupling Problems -- 5.10 Characteristic Impedance and the Error Budget -- 5.11 Resistor Networks -- 5.12 Ferrite Beads -- 5.13 Grounding in Facilities: A Brief Review -- 5.14 Grounding as Applied to Electronic Hardware -- 5.15 Internal Grounding of a Digital Circuit Board -- 5.16 Power Line Interference -- 5.17 Electrostatic Discharge -- Glossary -- 6 CIRCUIT BOARDS -- 6.1 Introduction -- 6.2 More about Characteristic Impedance -- 6.3 Microstrip -- 6.4 Centered Stripline.

6.5 Embedded Microstrip -- 6.6 Asymmetric Stripline -- 6.7 Two-Layer Boards -- 6.8 Four-Layer Circuit Board -- 6.9 Six-Layer Boards -- Glossary -- Abbreviations and Acronyms -- Bibliography -- Index.