Ceramics Science and Technology -- Contents -- Preface -- List of Contributors -- Part I: Powders -- 1 Powder Compaction by Dry Pressing -- 1.1 Introduction -- 1.2 Fundamental Aspects of Dry Pressing -- 1.2.1 Die or Mold Filling Behavior of Powders -- 1.2.1.1 Particle Packing: A Static View -- 1.2.1.2 Practical Aspects of Die Filling With Granulates -- 1.2.2 Compaction Behavior -- 1.2.2.1 Compaction of Monolithic Powders -- 1.2.2.2 Compaction of Granulated Powders -- 1.2.2.3 Understanding Powder Compaction by Advanced Modeling -- 1.3 Practice of Uniaxial Compaction -- 1.3.1 Die Filling -- 1.3.2 Tooling Principles and Pressing Tools -- 1.3.3 Powder Compaction Presses -- 1.4 Practice of Isostatic Compaction -- 1.4.1 Wet-Bag Isostatic Pressing -- 1.4.2 Dry-Bag Isostatic Pressing -- 1.5 Granulation of Ceramic Powders -- 1.5.1 Spray-Drying -- 1.5.2 Alternative Spray Granulation Methods -- 1.5.3 Characterization of Ceramic Granulates -- References -- 2 Tape Casting -- 2.1 Use of the Tape Casting Process -- 2.2 Process Variations -- 2.3 Tape Casting Process -- 2.4 Components of the Slurry -- 2.4.1 Inorganic Raw Materials -- 2.4.2 Solvents -- 2.4.3 Organic Raw Materials -- 2.4.3.1 Dispersing Agents -- 2.4.3.2 Binder and Plasticizer -- 2.4.3.3 Other Additives -- 2.4.4 Interaction between Slurry Components -- 2.5 Preparation of the Slurry and its Properties -- 2.6 Tape Casting -- 2.6.1 Drying and Characteristics of the Green Tape -- 2.7 Machining, Metallization, and Lamination -- 2.8 Binder Burnout -- 2.9 Firing -- 2.10 Summary -- References -- 3 Hydrothermal Routes to Advanced Ceramic Powders and Materials -- 3.1 Introduction to Hydrothermal Synthesis -- 3.1.1 Fundamental De.nitions -- 3.1.2 Process Development and Industrial Production -- 3.1.3 Hydrothermal Hybrid Techniques -- 3.1.4 Physical and Chemical Advantages of Hydrothermal Solutions.

3.2 Engineering Ceramic Synthesis in Hydrothermal Solution -- 3.2.1 Phase Partitioning in Hydrothermal Systems -- 3.2.2 A Rational Approach for Engineering Hydrothermal Synthesis Methods -- 3.2.3 Thermodynamic Modeling -- 3.2.4 Examples of Synthesis Engineering -- 3.3 Materials Chemistry of Hydrothermal Ceramic Powders -- 3.3.1 Control of Chemical Composition -- 3.3.2 Physical Characteristics and their Control -- 3.4 Ceramics Processed from Hydrothermally Synthesized Powders -- 3.4.1 Synthesis of Modified Powders for Enhanced Sinterability -- 3.4.2 Powders for Sintered Dense Ceramics with Fine Grain Size -- 3.4.3 Sintered Porous Ceramics from Hydrothermally Synthesized Powders -- 3.4.4 Fabrication of Textured Ceramics from Hydrothermal Powders -- 3.4.5 In-Situ Hydrothermal Conversion and Hydrothermal Sintering -- 3.5 Summary -- References -- 4 Liquid Feed-Flame Spray Pyrolysis (LF-FSP) in the Synthesis of Single- and Mixed-Metal Oxide Nanopowders -- 4.1 Introduction -- 4.2 Basic Concepts of Nanopowder Formation During LF-FSP -- 4.2.1 Particle Size Distributions -- 4.2.2 Phase Formation -- 4.2.3 Phase Characterization -- 4.3 Can Nanoparticles Be Prepared That Consist of Mixed Phases? -- 4.3.1 The TiO2/Al2O3 System -- 4.3.2 Changing Band Gaps -- 4.4 Which Particle Morphologies Can be Accessed? -- 4.5 Can Nanopowders Be Doped? -- 4.5.1 Sinter-Resistant Materials -- 4.5.2 Laser Paints -- References -- 5 Sol-Gel Processing of Ceramics -- 5.1 Introduction -- 5.2 Principles of Sol-Gel Processing -- 5.3 Porous Materials -- 5.4 Hybrid Materials -- 5.5 Bioactive Sol-Gel Materials -- 5.5.1 In-Situ Encapsulation of Biomolecules -- 5.5.2 Bioactive Materials -- References -- Part II: Densification and Beyond -- 6 Sintering -- 6.1 Sintering Phenomena -- 6.2 Solid-State Sintering -- 6.2.1 Sintering Models and Kinetics with No Grain Growth.

6.2.1.1 Initial Stage Model and Kinetics -- 6.2.1.2 Intermediate and Final Stage Models and Kinetics -- 6.2.1.3 Grain Boundary Structure and Densification Kinetics -- 6.2.2 Grain Growth -- 6.2.2.1 Normal Grain Growth -- 6.2.2.2 Grain Growth in the Presence of Second-Phase Particles -- 6.2.2.3 Grain Growth with Boundary Segregation -- 6.2.2.4 Grain Growth Behavior with Boundary Structure -- 6.2.3 Microstructure Development -- 6.3 Liquid-Phase Sintering -- 6.3.1 Densification Models and Theories -- 6.3.1.1 Contact Flattening -- 6.3.1.2 Pore Filling -- 6.3.2 Grain Growth -- 6.3.3 Microstructure Development -- 6.4 Summary -- References -- 7 Hot Isostatic Pressing and Gas-Pressure Sintering -- 7.1 Introduction -- 7.2 Sintering Mechanisms with Applied Pressure -- 7.3 Silicon Nitride Ceramics: Comparison of Capsule HIP and Sinter-HIP Technology -- 7.3.1 Capsule HIP -- 7.3.2 Sinter-HIP -- 7.3.3 Differences between Capsule-HIP and Sinter-HIP -- 7.4 Other Applications -- 7.4.1 Structural Ceramics -- 7.4.2 Post-HIPing of Oxide Ceramics for Optical Applications -- References -- 8 Hot Pressing and Spark Plasma Sintering -- 8.1 Introduction -- 8.2 Advantages of Sintering Under a Uniaxial Pressure -- 8.3 Conventional Hot Presses -- 8.4 SPS Set-Up -- 8.5 Unique Features and Advantages of the SPS Process -- 8.6 The Role of High Pressure -- 8.7 The Role of Rapid and Effective Heating -- 8.8 The Role of Pulsed Direct Current -- 8.9 Microstructural Prototyping by SPS -- 8.9.1 Nanoceramics and Ceramics Nanocomposites -- 8.9.2 Self-Reinforced Ceramics -- 8.9.3 Superplasticity and Textured Ceramics -- 8.9.4 Non-Equilibrium Ceramic Composites -- 8.9.5 Ceramics with Macro- and Micro- Graded Structures -- 8.9.6 Hard-to-Make Ceramics -- 8.9.7 Defect-Engineered Ceramics -- 8.10 Potential Industrial Applications -- References -- 9 Fundamentals and Methods of Ceramic Joining.

9.1 Introduction -- 9.2 Basic Phenomena in Ceramic Joining -- 9.2.1 Mechanics -- 9.2.1.1 The Strength of Ceramics -- 9.2.1.2 Contact Stress -- 9.2.1.3 Residual Stress -- 9.2.1.4 Elastic Modulus Effects -- 9.2.1.5 Other Effects -- 9.2.1.6 Strength of Bonded Joints -- 9.2.2 Adhesion and Wetting -- 9.2.3 Diffusion -- 9.2.4 Chemical Reaction -- 9.3 Methods of Joining -- 9.3.1 Mechanical Joining -- 9.3.2 Direct Bonding -- 9.3.2.1 Solid-State Direct-Bonding Processes -- 9.3.2.2 Liquid-State Direct-Bonding Processes -- 9.3.3 Interlayer Bonding -- 9.3.3.1 Solid-State Interlayer Bonding Processes -- 9.3.3.2 Liquid-State Interlayer Bonding Processes -- 9.4 Conclusions -- References -- 10 Machining and Finishing of Ceramics -- 10.1 Introduction -- 10.2 Face and Profile Grinding -- 10.2.1 Process Description -- 10.2.2 Machining of Ceramics -- 10.3 Current Status and Future Prospects -- 10.4 Double-Face Grinding with Planetary Kinematics -- 10.4.1 Process Description -- 10.4.2 Machining of Ceramics -- 10.4.3 Current Status and Future Prospects -- 10.5 Ultrasonic-Assisted Grinding -- 10.5.1 Process Description -- 10.5.2 Machining of Ceramics -- 10.5.3 Current Status and Future Prospects -- 10.6 Abrasive Flow Machining -- 10.6.1 Process Description -- 10.6.2 Machining of Ceramics -- 10.6.3 Current Status and Future Prospects -- 10.7 Outlook -- References -- Part III: Films and Coatings -- 11 Vapor-Phase Deposition of Oxides -- 11.1 Introduction -- 11.1.1 Sputter Deposition -- 11.1.2 Pulsed-Laser Deposition -- 11.1.3 Oxide Molecular Beam Epitaxy -- 11.2 Summary -- References -- 12 Metal-Organic Chemical Vapor Deposition of Metal Oxide Films and Nanostructures -- 12.1 Introduction -- 12.2 Metal Oxide Film Deposition -- 12.2.1 Physical and Chemical Vapor Deposition Techniques -- 12.2.2 Chemical Vapor Deposition -- 12.2.2.1 Thermally Activated CVD (TA-CVD).

12.2.2.2 Plasma-Enhanced CVD (PE-CVD) -- 12.2.2.3 Molecule-Based CVD (MB-CVD) -- 12.2.3 Atomic Layer Deposition -- 12.2.4 Growth Dynamics -- 12.2.4.1 Amorphous Growth -- 12.2.4.2 Epitaxial Growth -- 12.2.4.3 Polycrystalline Growth -- 12.2.5 Mechanistic Aspects of CVD -- 12.3 The Precursor Concept in CVD -- 12.3.1 Precursor Requisites -- 12.3.2 Precursor-Material Relationship -- 12.3.3 Influence of Precursor Flow Rate on Microstructure and Growth -- 12.4 Metal Oxide Coatings -- 12.4.1 Monometallic Precursor (MOx) Systems -- 12.4.2 Bimetallic Precursor (MM.Ox) Systems -- 12.4.3 Composites (MOx/M.Oy) Systems -- 12.5 Summary -- References -- Part IV: Manufacturing Technology -- 13 Powder Characterization -- 13.1 Introduction -- 13.1.1 Accuracy Versus Precision and Instrument Resolution -- 13.1.2 Sampling -- 13.2 Chemical Composition and Surface Characterization -- 13.2.1 Bulk Elemental Identi.cation -- 13.2.1.1 Optical Absorption Spectroscopy -- 13.2.1.2 Electron and X-Ray Microanalysis -- 13.2.1.3 Infrared Spectroscopy -- 13.2.1.4 Raman Spectroscopy -- 13.2.1.5 Nuclear Magnetic Resonance Spectroscopy -- 13.2.1.6 Detailed Depth Profiling of Elemental Distribution within a Particle -- 13.2.2 Surface Characterization -- 13.2.2.1 Surface Chemistry Analysis -- 13.2.2.2 Vacuum Techniques -- 13.2.2.3 Specific Surface Area of Particles -- 13.2.2.4 Electrokinetic Potential or Zeta-Potential -- 13.2.3 Crystallographic Identification -- 13.3 Particle Sizing and Data Interpretation -- 13.3.1 Particles Types -- 13.3.2 Particle Shapes -- 13.3.3 General Methods -- 13.3.4 Light Scattering Techniques -- 13.3.5 Sedimentation Analysis -- 13.3.6 Coulter Counter -- 13.3.7 Image-Based Analysis -- 13.3.8 Sieve Analysis -- 13.3.8.1 Dry Sieving -- 13.3.8.2 Wet Sieving -- 13.4 Physical Properties -- 13.4.1 Particle Density -- 13.4.1.1 Particle Density Definition.

13.4.1.2 Particle Density Measurement.